发明授权
- 专利标题： TAB type semiconductor device
- 专利标题（中）： TAB型半导体器件
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申请号： US10278272申请日： 2002-10-22
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公开(公告)号： US06909184B2公开(公告)日： 2005-06-21
- 发明人: Toshihiro Ushijima , Isao Baba , Takamitsu Sumiyoshi
- 申请人： Toshihiro Ushijima , Isao Baba , Takamitsu Sumiyoshi
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Hogan & Hartson, LLP
- 优先权： JP11-351902 19991210
- 主分类号： H01L23/13
- IPC分类号： H01L23/13 ; H01L23/498 ; H05K1/02 ; H05K1/11 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
There is disclosed a TAB style BGA type semiconductor device. This semiconductor device comprises a semiconductor chip on which an integrated circuit is formed, and a polyimide tape which has a conductive pattern and which is allowed to adhere to the semiconductor chip. The conductive pattern includes a bonding portion connected to the pad of the semiconductor chip, a pad portion connected to the outside electrode, and an electrically floating island-like portion in addition to a wiring portion for connecting the bonding portion and the pad portion.
公开/授权文献
- US20030042588A1 TAB type semiconductor device 公开/授权日：2003-03-06