发明授权
US06913980B2 Process method of source drain spacer engineering to improve transistor capacitance
有权
源极间隔工程的工艺方法,以提高晶体管电容
- 专利标题: Process method of source drain spacer engineering to improve transistor capacitance
- 专利标题(中): 源极间隔工程的工艺方法,以提高晶体管电容
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申请号: US10609823申请日: 2003-06-30
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公开(公告)号: US06913980B2公开(公告)日: 2005-07-05
- 发明人: Zhiqiang Wu , Jihong Chen , Kaiping Liu
- 申请人: Zhiqiang Wu , Jihong Chen , Kaiping Liu
- 申请人地址: US TX Dallas
- 专利权人: Texas Instruments Incorporated
- 当前专利权人: Texas Instruments Incorporated
- 当前专利权人地址: US TX Dallas
- 代理商 Yingsheng Tung; Wade James Brady, III; Frederick J. Telecky, Jr.
- 主分类号: H01L21/265
- IPC分类号: H01L21/265 ; H01L21/336 ; H01L21/8238 ; H01L29/78
摘要:
A method of forming an associated transistor is presented whereby short channel effects and junction capacitances are mitigated and enhanced switching speeds are thereby facilitated. Compensation regions are formed within a substrate by implanting dopants relatively deeply over source and drain regions formed within the substrate. The compensation regions are spaced apart slightly less than are the source and drain regions. This spacing affects potential contours and reduces junction capacitances within the transistor. The different distances between the source and drain regions and the compensation regions are achieved by forming and selectively adjusting sidewall spacers adjacent to a gate structure of the transistor. These spacers serve as guides for the dopants implanted into the substrate to form the source and drain regions and the compensation regions.
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