Invention Grant
US06916718B2 Approach to prevent undercut of oxide layer below gate spacer through nitridation
有权
通过氮化防止栅极隔离层下面的氧化层底切的方法
- Patent Title: Approach to prevent undercut of oxide layer below gate spacer through nitridation
- Patent Title (中): 通过氮化防止栅极隔离层下面的氧化层底切的方法
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Application No.: US10613606Application Date: 2003-07-03
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Publication No.: US06916718B2Publication Date: 2005-07-12
- Inventor: Ying-Lin Chen , Chiang-Lang Yen , Ling-Sung Wang
- Applicant: Ying-Lin Chen , Chiang-Lang Yen , Ling-Sung Wang
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/336

Abstract:
A method is provided for the removal of liner oxide from the surface of a gate electrode during the creation of the gate electrode. A layer of gate oxide is formed over the surface of a substrate, a layer of gate electrode is deposited over the layer of gate oxide. The gate electrode is deposited, gate spacers are formed over the liner oxide, exposing surfaces of the liner oxide. The created structure is nitrided by a plasma stream containing N2/H2, reducing the etch rate of the exposed liner oxide. The liner oxide is then removed by applying a wet etch, contact regions to the gate electrode are salicided.
Public/Granted literature
- US20040005750A1 Approach to prevent spacer undercut by low temperature nitridation Public/Granted day:2004-01-08
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