Invention Grant
US06919642B2 Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed
失效
用于将IC芯片接合到形成有虚设凸块和非导电粘合剂和结构的基板的方法
- Patent Title: Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed
- Patent Title (中): 用于将IC芯片接合到形成有虚设凸块和非导电粘合剂和结构的基板的方法
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Application No.: US10190276Application Date: 2002-07-05
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Publication No.: US06919642B2Publication Date: 2005-07-19
- Inventor: Yu-Te Hsieh , Shyh-Ming Chang , Wen-Ti Lin
- Applicant: Yu-Te Hsieh , Shyh-Ming Chang , Wen-Ti Lin
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Akin Gump Strauss Hauer & Feld, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H05K1/02 ; H05K3/30 ; H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.
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