公开(公告)号：US07300865B2

公开(公告)日：2007-11-27

申请号：US11183590

申请日：2005-07-18

申请人： Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

发明人： Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

IPC分类号： H01L24/4763 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/305 ,  H01L2224/13111 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05599

摘要： An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.

摘要翻译： 通过非导电粘合剂粘合在一起的IC芯片/基板组件和用于形成组件的方法。 该组件由在有源表面上形成的凸块的IC芯片，具有形成在顶面上的接合焊盘的基板构成，其中IC芯片和基板中的至少一个具有形成在凸块之间或 接合焊盘和设置在IC芯片和基板之间的非导电粘合剂，其与与焊盘电连通的凸块面对面地连接在一起。

公开(公告)号：US06919642B2

公开(公告)日：2005-07-19

申请号：US10190276

申请日：2002-07-05

申请人： Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

发明人： Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

IPC分类号： H01L21/56 ,  H05K1/02 ,  H05K3/30 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/305 ,  H01L2224/13111 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05599

摘要： An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.

摘要翻译： 通过非导电粘合剂粘合在一起的IC芯片/基板组件和用于形成组件的方法。 该组件由在有源表面上形成的凸块的IC芯片，具有形成在顶面上的接合焊盘的基板构成，其中IC芯片和基板中的至少一个具有形成在凸块之间或 接合焊盘和设置在IC芯片和基板之间的非导电粘合剂，其与与焊盘电连通的凸块面对面地连接在一起。

公开(公告)号：US20050250303A1

公开(公告)日：2005-11-10

申请号：US11183590

申请日：2005-07-18

申请人： Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

发明人： Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

IPC分类号： H01L21/56 ,  H05K1/02 ,  H05K3/30 ,  H01L21/50

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/305 ,  H01L2224/13111 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05599

摘要： An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.

摘要翻译： 通过非导电粘合剂粘合在一起的IC芯片/基板组件和用于形成组件的方法。 该组件由在有源表面上形成的凸块的IC芯片，具有形成在顶面上的接合焊盘的基板构成，其中IC芯片和基板中的至少一个具有形成在凸块之间或 接合焊盘和设置在IC芯片和基板之间的非导电粘合剂，其与与焊盘电连通的凸块面对面地连接在一起。

公开(公告)号：US06605491B1

公开(公告)日：2003-08-12

申请号：US10152468

申请日：2002-05-21

申请人： Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

发明人： Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

IPC分类号： H01L2144

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/0665 ,  H01L2924/00

摘要： A method for bonding an IC chip by a non-conductive adhesive that contains between about 5 weight % and about 25 weight % of a non-conductive filler is described. The filler particles in the filler material must have a hardness that is higher, and preferably at least two times higher, than the metal material forming the bump. Moreover, the filler particles must be non-electrically conductive such that electrical shorts between a plurality of bumps on the IC chip do not occur. The concentration of the filler in the adhesive must be high enough so as to reduce the CTE of the adhesive to match that of the IC chip and the substrate, and low enough so as not to impede the electrical communication between the bumps on the IC chip and the bond pads on the substrate.

摘要翻译： 描述了通过非导电粘合剂粘合IC芯片的方法，其包含约5重量％至约25重量％的非导电填料。 填充材料中的填料颗粒必须具有比形成凸块的金属材料高的硬度，优选至少两倍的硬度。 此外，填料颗粒必须是非导电的，使得不会发生IC芯片上的多个凸点之间的电短路。 填料在粘合剂中的浓度必须足够高，以便减少粘合剂的CTE与IC芯片和基材的CTE相匹配，并且足够低，以免阻碍IC芯片上的凸块之间的电连通 和衬底上的接合焊盘。

公开(公告)号：US20120140059A1

公开(公告)日：2012-06-07

申请号：US13039276

申请日：2011-03-02

申请人： Hsiao-Liang Hsieh ,  Wen-Ti Lin ,  Hsiang-Cheng Hsieh

发明人： Hsiao-Liang Hsieh ,  Wen-Ti Lin ,  Hsiang-Cheng Hsieh

IPC分类号： H04N7/18

CPC分类号： G01J1/0252 ,  G01J1/4228 ,  G01J2001/4252 ,  G01R31/2635 ,  G01R31/2893

摘要： An inspection machine capable of inspecting optical property and electrical property of a light emitting device is provided. The inspection machine includes a substrate table, a probe mechanism, a heating apparatus, a cooling apparatus, an image-sensing apparatus, a temperature-sensing apparatus and a moving mechanism. The probe mechanism is capable of moving toward the light emitting device to contact therewith. The heating apparatus is capable of heating the light emitting device within a first temperature range. The cooling apparatus is capable of cooling the light emitting device within a second temperature range. The image-sensing apparatus senses a light emitting image provided from the light emitting device. The temperature-sensing apparatus senses the present temperature of the light emitting device. The image-sensing apparatus is disposed on the moving mechanism. The moving mechanism is capable of moving the image-sensing apparatus. An inspecting method and an inspecting system for the inspection machine are also provided.

摘要翻译： 提供了能够检查发光装置的光学特性和电气性能的检查机。 检查机包括基板台，探针机构，加热装置，冷却装置，图像感测装置，温度感测装置和移动机构。 探针机构能够向发光器件移动以与其接触。 加热装置能够在第一温度范围内加热发光装置。 冷却装置能够在第二温度范围内冷却发光装置。 图像感测装置感测从发光装置提供的发光图像。 温度感测装置感测发光装置的当前温度。 图像感测装置设置在移动机构上。 移动机构能够移动图像感测装置。 还提供了检验机的检查方法和检查系统。

公开(公告)号：US06830981B2

公开(公告)日：2004-12-14

申请号：US10301715

申请日：2002-11-22

申请人： Chun-Tao Lee ,  Lin-Hung Shi ,  Chi-Cherng Jeng ,  Wen-Ti Lin ,  Wei-Su Chen

发明人： Chun-Tao Lee ,  Lin-Hung Shi ,  Chi-Cherng Jeng ,  Wen-Ti Lin ,  Wei-Su Chen

IPC分类号： H01L21331

CPC分类号： H01L51/057 ,  B82Y10/00 ,  H01L51/0048 ,  H01L51/0504 ,  H01L51/0595 ,  Y10S977/843 ,  Y10S977/845

摘要： A vertical nanotube transistor and a process for fabricating the same. First, a source layer and a catalyst layer are successively formed on a substrate. A dielectric layer is formed on the catalyst layer and the substrate. Next, the dielectric layer is selectively removed to form a first dielectric mesa, a gate dielectric layer spaced apart from the first dielectric mesa by a first opening, and a second dielectric mesa spaced apart from the gate dielectric layer by a second opening. Next, a nanotube layer is formed in the first opening. Finally, a drain layer is formed on the nanotube layer and the first dielectric mesa, and a gate layer is formed in the second opening. The formation position of the nanotubes can be precisely controlled.

公开(公告)号：US08421858B2

公开(公告)日：2013-04-16

申请号：US13039276

申请日：2011-03-02

申请人： Hsiao-Liang Hsieh ,  Wen-Ti Lin ,  Hsiang-Cheng Hsieh

发明人： Hsiao-Liang Hsieh ,  Wen-Ti Lin ,  Hsiang-Cheng Hsieh

IPC分类号： H04N9/47 ,  G06K9/00

CPC分类号： G01J1/0252 ,  G01J1/4228 ,  G01J2001/4252 ,  G01R31/2635 ,  G01R31/2893

摘要： An inspection machine capable of inspecting optical property and electrical property of a light emitting device is provided. The inspection machine includes a substrate table, a probe mechanism, a heating apparatus, a cooling apparatus, an image-sensing apparatus, a temperature-sensing apparatus and a moving mechanism. The probe mechanism is capable of moving toward the light emitting device to contact therewith. The heating apparatus is capable of heating the light emitting device within a first temperature range. The cooling apparatus is capable of cooling the light emitting device within a second temperature range. The image-sensing apparatus senses a light emitting image provided from the light emitting device. The temperature-sensing apparatus senses the present temperature of the light emitting device. The image-sensing apparatus is disposed on the moving mechanism. The moving mechanism is capable of moving the image-sensing apparatus. An inspecting method and an inspecting system for the inspection machine are also provided.

摘要翻译： 提供了能够检查发光装置的光学特性和电气性能的检查机。 检查机包括基板台，探针机构，加热装置，冷却装置，图像感测装置，温度感测装置和移动机构。 探针机构能够向发光器件移动以与其接触。 加热装置能够在第一温度范围内加热发光装置。 冷却装置能够在第二温度范围内冷却发光装置。 图像感测装置感测从发光装置提供的发光图像。 温度感测装置感测发光装置的当前温度。 图像感测装置设置在移动机构上。 移动机构能够移动图像感测装置。 还提供了检验机的检查方法和检查系统。