Invention Grant
- Patent Title: Heat-dissipating assembly
- Patent Title (中): 散热组件
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Application No.: US10417734Application Date: 2003-04-16
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Publication No.: US06920045B2Publication Date: 2005-07-19
- Inventor: Wen-shi Huang , Kuo-cheng Lin , Li-kuang Tan , Yu-hung Huang
- Applicant: Wen-shi Huang , Kuo-cheng Lin , Li-kuang Tan , Yu-hung Huang
- Applicant Address: TW Taoyuan
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan
- Agency: Birch, Stewart, Kolasch & Birch, LLP.
- Priority: TW9122103U 20021224
- Main IPC: H01L23/467
- IPC: H01L23/467 ; H05K7/20
Abstract:
A heat-dissipating assembly utilizes a heat conductor having a high thermal conductivity to stagedly and effectively dissipate the heat to the surrounding environment. The heat-dissipating assembly includes a plurality of heat portions, at least one fan being disposed on the surface or side of the heat-dissipating portions, and a heat conductor having a high thermal conductivity connected within the plurality of the heat-dissipating portions.
Public/Granted literature
- US20040120115A1 Heat-dissipating assembly Public/Granted day:2004-06-24
Information query
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