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公开(公告)号:US06920045B2
公开(公告)日:2005-07-19
申请号:US10417734
申请日:2003-04-16
申请人: Wen-shi Huang , Kuo-cheng Lin , Li-kuang Tan , Yu-hung Huang
发明人: Wen-shi Huang , Kuo-cheng Lin , Li-kuang Tan , Yu-hung Huang
IPC分类号: H01L23/467 , H05K7/20
CPC分类号: H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: A heat-dissipating assembly utilizes a heat conductor having a high thermal conductivity to stagedly and effectively dissipate the heat to the surrounding environment. The heat-dissipating assembly includes a plurality of heat portions, at least one fan being disposed on the surface or side of the heat-dissipating portions, and a heat conductor having a high thermal conductivity connected within the plurality of the heat-dissipating portions.
摘要翻译: 散热组件利用具有高热导率的导热体来分期地且有效地将热量散发到周围的环境中。 散热组件包括多个加热部分,至少一个风扇设置在散热部分的表面或侧面,以及在多个散热部分内连接有导热系数高的导热体。
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公开(公告)号:US06822864B2
公开(公告)日:2004-11-23
申请号:US10310510
申请日:2002-12-04
申请人: Wen-shi Huang , Kuo-cheng Lin , Fu-hau Tsai , Yu-hung Huang
发明人: Wen-shi Huang , Kuo-cheng Lin , Fu-hau Tsai , Yu-hung Huang
IPC分类号: H05K720
CPC分类号: H01L23/467 , H01L23/4093 , H01L2924/0002 , Y10T24/44017 , Y10T24/44026 , H01L2924/00
摘要: The invention provides a heat-dissipating assembly and a securing device used therein, which utilizes a way of securing by applying force in one direction to prevent the surface of a chip from being damaged. The securing device includes a frame body having a plurality of first fasteners fastened to a socket by the first fasteners; and a wrenching member pivotally coupled to the frame body, wherein after applying an external force on the wrenching member in one direction, the heat-dissipating device can be fixed tightly on the socket.
摘要翻译: 本发明提供了一种散热组件和其中使用的固定装置,其利用通过在一个方向上施加力来固定的方式,以防止芯片的表面被损坏。 固定装置包括:框体,其具有通过第一紧固件固定到插座的多个第一紧固件; 以及可枢转地联接到所述框架体的扳手构件,其中在沿一个方向对所述扳手构件施加外力之后,所述散热装置可以紧固地固定在所述插座上。
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公开(公告)号:US06729385B1
公开(公告)日:2004-05-04
申请号:US10462305
申请日:2003-06-13
申请人: Wen-shi Huang , Kuo-cheng Lin , Yu-hung Huang , Wei-fang Wu
发明人: Wen-shi Huang , Kuo-cheng Lin , Yu-hung Huang , Wei-fang Wu
IPC分类号: F28F700
CPC分类号: H01L23/3672 , F28F3/02 , H01L2924/0002 , H01L2924/00
摘要: A fin structure is disclosed. The fin structure includes a first concavo-convex portion formed with a concave on a first surface of the fin in the direction of thickness and a corresponding convex on a second surface of the fin in the direction of thickness. Besides, a second concavo-convex portion formed with a first concave and second concave on the first surface of the fin in the direction of thickness and a corresponding first convex and a corresponding second convex on the second surface of the fin in the direction of thickness is included as well. Specifically, the first and second concavo-convex portions are symmetrical respect to the center of the fin. Furthermore, the second convex of the second concavo-convex portion on one fin can be exactly received by the concave of the first concavo-convex portion on another fin.
摘要翻译: 公开了一种翅片结构。 翅片结构包括在翅片的厚度方向的第一表面上形成有凹部的第一凹凸部分和在翅片的厚度方向的第二表面上的对应凸起。 此外,在翅片的厚度方向的第一表面上形成有第一凹部和第二凹部的第二凹凸部和在翅片的第二表面上的相应的第一凸部和相应的第二凸部,沿厚度方向 也包括在内。 具体地说,第一和第二凹凸部相对于翅片的中心对称。 此外,一个翅片上的第二凹凸部的第二凸部可以由另一个翅片上的第一凹凸部的凹部精确地接收。
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公开(公告)号:US07044195B2
公开(公告)日:2006-05-16
申请号:US10637374
申请日:2003-08-07
申请人: Chin-ming Chen , Yu-hung Huang , Wei-fang Wu
发明人: Chin-ming Chen , Yu-hung Huang , Wei-fang Wu
IPC分类号: H05K7/20
CPC分类号: H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation structure made of a heat-conductive material, comprising at least one penetration portion which penetrates therethrough. The at least one penetration portion further comprises a solid portion which is located at the center of the at least one penetration portion and provided with a penetration hole penetrating therethrough, and at least one bridge portion which surrounds the solid portion and is connected between the solid portion and the body of the heat dissipation structure.
摘要翻译: 由导热材料制成的散热结构,包括穿透其中的至少一个穿透部分。 所述至少一个穿透部分还包括固体部分,所述固体部分位于所述至少一个穿透部分的中心并且设置有贯穿其的穿透孔,以及至少一个桥接部分,其围绕所述固体部分并且连接在所述固体 部分和散热结构体。
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