Invention Grant
- Patent Title: Component mounting apparatus
- Patent Title (中): 组件安装设备
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Application No.: US09812249Application Date: 2001-03-19
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Publication No.: US06920686B2Publication Date: 2005-07-26
- Inventor: Kenji Okamoto , Kazuyuki Nakano , Takeshi Takeda
- Applicant: Kenji Okamoto , Kazuyuki Nakano , Takeshi Takeda
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Jordan and Hamburg LLP
- Priority: JP2000-075607 20000317
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H05K3/30

Abstract:
A component mounting apparatus has an intermittently rotated rotary mounting section which has a driver at an upper part for driving motors of mounting heads arranged on periphery of the rotary mounting section. A controller in a stationary part of the apparatus inputs power and control signals to the rotating driver which is formed in an annular shape, and includes motor driver mounting plates with motor drivers for controlling power supplied to each motor. The motor driver mounting plates are arranged radially around a rotation axis of the rotating driver with planar surfaces in parallel to the rotation axis.
Public/Granted literature
- US20020020056A1 Component mounting apparatus Public/Granted day:2002-02-21
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