发明授权
- 专利标题: Semiconductor device and method of fabricating the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US10713221申请日: 2003-11-17
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公开(公告)号: US06921933B2公开(公告)日: 2005-07-26
- 发明人: Hiroyuki Umimoto , Shinji Odanaka
- 申请人: Hiroyuki Umimoto , Shinji Odanaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 代理机构: Nixon Peabody LLP
- 代理商 Donald R. Studebaker
- 优先权: JP11-133846 19990514
- 主分类号: H01L21/265
- IPC分类号: H01L21/265 ; H01L21/336 ; H01L29/10 ; H01L29/76
摘要:
A gate electrode is formed on a semiconductor substrate with agate insulating film interposed therebetween. A channel region composed of a first-conductivity-type semiconductor layer is formed in a region of a surface portion of the semiconductor substrate located below the gate electrode. Source/drain regions each composed of a second-conductivity-type impurity layer are formed in regions of the surface portion of the semiconductor substrate located on both sides of the gate electrode. Second-conductivity-type extension regions are formed between the channel region and respective upper portion of the source/drain regions in contact relation with the source/drain regions. First-conductivity-type pocket regions are formed between the channel region and respective lower portion of the source/drain regions in contact relation with the source/drain regions and in spaced relation to the gate insulating film.
公开/授权文献
- US20040099890A1 Semiconductor device and method of fabricating the same 公开/授权日:2004-05-27
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