发明授权
- 专利标题： Integrated circuit device installed structure and installation method
- 专利标题（中）： 集成电路装置安装结构及安装方法
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申请号： US10388617申请日： 2003-03-17
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公开(公告)号： US06924540B2公开(公告)日： 2005-08-02
- 发明人: Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
- 申请人： Yasufumi Shirakawa , Masaki Taniguchi , Hideo Fukuda , Yuzo Shimizu , Shinya Esaki
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2002-076082 20020319
- 主分类号： G11B7/13
- IPC分类号： G11B7/13 ; G11B7/24 ; H01L21/50 ; H01L21/56 ; H01L23/02 ; H01L23/28 ; H01L23/50 ; H01L27/14 ; H01L31/02 ; H01L31/0203 ; H01L47/00
摘要：
A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. The integrated circuit device having a photo detecting part, leads and wires for connection therebetween are encapsulated in an encapsulation section. A recess is formed on the light incident surface of the encapsulation section above the photo detecting part, to thin the encapsulation section on the surface of the photo detecting part and thereby reduce the energy of light absorbed by the encapsulation section.
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