发明授权
- 专利标题: Relay device and relay device mounting structure
- 专利标题(中): 继电器和继电器安装结构
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申请号: US10316026申请日: 2002-12-11
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公开(公告)号: US06924964B2公开(公告)日: 2005-08-02
- 发明人: Hiroyuki Ashiya , Masataka Suzuki , Yoshiyuki Tanaka , Shingo Matsuura
- 申请人: Hiroyuki Ashiya , Masataka Suzuki , Yoshiyuki Tanaka , Shingo Matsuura
- 申请人地址: JP Tokyo
- 专利权人: Yazaki Corporation
- 当前专利权人: Yazaki Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JPP2001-377219 20011211
- 主分类号: H05K3/34
- IPC分类号: H05K3/34 ; H01H1/58 ; H01H45/04 ; H01H45/14 ; H01H50/14 ; H01H50/44 ; H05K1/18 ; H05K3/30 ; H01H47/00
摘要:
Terminals (11, 13) for electrical connection respectively have front end portions (11b, 13b) to be joined to a wiring board (20) with solder and base end portions (11a, 13a) drawn outside from a cover (7) made of heat-expanding material. In order for the base end portions to absorb stress countering the external force received from the cover subjected to thermal expansion due to the heat generated by an electromagnetic coil (5) by the deflection deformation of the intermediate portions (11c, 13c) of the terminals positioned closer to the cover than the wiring board 20 with the relay device mounted on the wiring board, the terminals are formed with a predetermined length of L′ in the extending direction of the terminals so that the length required for necessary flexibility is secured for the intermediate portions.
公开/授权文献
- US20030109170A1 Relay device and relay device mounting structure 公开/授权日:2003-06-12
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