发明授权
- 专利标题: Shallow trench isolation structure and method
- 专利标题(中): 浅沟隔离结构及方法
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申请号: US10196089申请日: 2002-07-16
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公开(公告)号: US06930018B2公开(公告)日: 2005-08-16
- 发明人: Freidoon Mehrad , Zhihao Chen , Shashank S. Ekbote , Brian Trentman
- 申请人: Freidoon Mehrad , Zhihao Chen , Shashank S. Ekbote , Brian Trentman
- 申请人地址: US TX Dallas
- 专利权人: Texas Instruments Incorporated
- 当前专利权人: Texas Instruments Incorporated
- 当前专利权人地址: US TX Dallas
- 代理商 Yingsheng Tung; Wade James Brady, III; Frederick J. Telecky, Jr.
- 主分类号: H01L21/762
- IPC分类号: H01L21/762 ; H01L21/8222
摘要:
Disclosed is a shallow trench isolation (STI) structure and methods of manufacturing the same. The methods eliminate the requirement for design size adjustments (DSA) in manufacturing the STI structure. Further disclosed is an STI trench liner and methods for the formation thereof by growing a thin oxide layer on shallow isolation trench surfaces while preventing oxide formation on adjacent nitride surfaces, followed by the deposition of, and oxide growth upon, a polysilicon layer.
公开/授权文献
- US20040014291A1 Shallow trench isolation structure and method 公开/授权日:2004-01-22
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