Invention Grant
- Patent Title: Grinding method and device for the same
- Patent Title (中): 研磨方法和装置相同
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Application No.: US10375948Application Date: 2003-02-28
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Publication No.: US06932673B2Publication Date: 2005-08-23
- Inventor: Hiroshi Morita , Takayuki Yoshimi , Ryohei Mukai
- Applicant: Hiroshi Morita , Takayuki Yoshimi , Ryohei Mukai
- Applicant Address: JP Aichi-Ken
- Assignee: Toyoda Koki Kabushiki Kaisha
- Current Assignee: Toyoda Koki Kabushiki Kaisha
- Current Assignee Address: JP Aichi-Ken
- Agency: Darby & Darby
- Priority: JP2002-55046 20020228
- Main IPC: B23Q11/10
- IPC: B23Q11/10 ; B24B5/04 ; B24B55/02 ; B24B49/00 ; B24B1/00 ; B24B51/00

Abstract:
The present invention supplies coolant to a grinding wheel surface and reliably guides the coolant to a grinding point on the grinding wheel surface, thereby significantly reducing the amount of coolant to be used.In a grinding method and device for supplying coolant while grinding a workpiece W with a rotating grinding wheel 1, a fluid nozzle 2 is disposed upstream from a grinding point 11 on the circumferential surface 10 of the grinding wheel 1. The fluid nozzle 2 blows a jet of fluid across an air layer 12, which is a layer of flowing air dragged along the circumferential surface 10 of the grinding wheel 1, from one lateral side of the air layer 12 to the other lateral side thereof. A grinding fluid nozzle 3 supplies coolant to a region between the grinding point 11 and a cutoff position 13 at which the fluid jet from the fluid nozzle 2 has deflected the air flow from the air layer 12. The coolant supplied from the grinding fluid nozzle 3 contacts the grinding point 11 on the grinding surface 10.
Public/Granted literature
- US20040005844A1 Grinding method and device for the same Public/Granted day:2004-01-08
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