发明授权
- 专利标题： Solder paste printing apparatus and printing method
- 专利标题（中）： 焊膏印刷装置及印刷方法
-
申请号： US10641082申请日： 2003-08-15
-
公开(公告)号： US06935232B2公开(公告)日： 2005-08-30
- 发明人: Hiroaki Onishi , Toshinori Mimura , Naoichi Chikahisa , Ken Takahashi , Toshiyuki Murakami , Hitoshi Nakahira , Sadayuki Nagashima
- 申请人： Hiroaki Onishi , Toshinori Mimura , Naoichi Chikahisa , Ken Takahashi , Toshiyuki Murakami , Hitoshi Nakahira , Sadayuki Nagashima
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP11-211330 19990726; JP11-252148 19990906; JP11-315384 19991105; JP11-347714 19991207; JP2000-220873 20000721
- 主分类号： B41F15/46
- IPC分类号： B41F15/46 ; H05K1/02 ; H05K3/00 ; H05K3/12 ; H05K3/26 ; B05C17/06 ; B05C17/08 ; B41L13/00 ; B41M1/12
摘要：
When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.
公开/授权文献
- US20040108368A1 Solder past printing apparatus and printing method 公开/授权日：2004-06-10