发明授权
- 专利标题： Method for mounting electronic components on substrates
- 专利标题（中）： 将电子部件安装在基板上的方法
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申请号： US10192630申请日： 2002-07-11
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公开(公告)号： US06935556B2公开(公告)日： 2005-08-30
- 发明人: Wolfgang Knapp
- 申请人： Wolfgang Knapp
- 申请人地址： CH Zurich
- 专利权人： ABB Research Ltd.
- 当前专利权人： ABB Research Ltd.
- 当前专利权人地址： CH Zurich
- 代理机构： Burns, Doane, Swecker & Mathis, LLP
- 优先权： EP01810711 20010718
- 主分类号： H01L21/52
- IPC分类号： H01L21/52 ; H01L21/00 ; H01L21/60 ; H01L21/603 ; B23K31/02
摘要：
In the method for mounting electronic components on substrates by means of pressure sintering, a paste which is composed of a metal powder and a solvent is applied between the component and the substrate. Once the paste has dried completely, the component is placed on the substrate. A number of such arrangements (4) together with a substrate and component are then compressed at the sintering temperature in an isostatic press (6). A large number of complex and/or fragile parts can be connected at the same time, and with very high precision.
公开/授权文献
- US20030016510A1 Method for mounting electronic components on substrates 公开/授权日：2003-01-23
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