发明授权
- 专利标题： MEMS device with conductive path through substrate
- 专利标题（中）： 具有导电通路的MEMS器件通过衬底
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申请号： US10827680申请日： 2004-04-19
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公开(公告)号： US06936918B2公开(公告)日： 2005-08-30
- 发明人: Kieran P. Harney , Lawrence E. Felton , Thomas Kieran Nunan , Susan A. Alie , Bruce Wachtmann
- 申请人： Kieran P. Harney , Lawrence E. Felton , Thomas Kieran Nunan , Susan A. Alie , Bruce Wachtmann
- 申请人地址： US MA Norwood
- 专利权人： Analog Devices, Inc.
- 当前专利权人： Analog Devices, Inc.
- 当前专利权人地址： US MA Norwood
- 代理机构： Bromberg & Sunstein LLP
- 主分类号： B81B7/00
- IPC分类号： B81B7/00 ; B81B7/02 ; H01L23/12
摘要：
A MEMS device has at least one conductive path extending from the top facing side of its substrate (having MEMS structure) to the bottom side of the noted substrate. The at least one conductive path extends through the substrate as noted to electrically connect the bottom facing side with the MEMS structure.
公开/授权文献
- US20050127499A1 MEMS DEVICE WITH CONDUCTIVE PATH THROUGH SUBSTRATE 公开/授权日：2005-06-16
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