发明授权
US06940156B2 Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module
有权
具有具有柔性芯片触点的半导体芯片的电子模块以及用于制造电子模块的方法
- 专利标题： Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module
- 专利标题（中）： 具有具有柔性芯片触点的半导体芯片的电子模块以及用于制造电子模块的方法
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申请号： US10673968申请日： 2003-09-29
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公开(公告)号： US06940156B2公开(公告)日： 2005-09-06
- 发明人: Michael Bauer , Christian Birzer , Gerald Ofner , Stephan Stoeckl
- 申请人： Michael Bauer , Christian Birzer , Gerald Ofner , Stephan Stoeckl
- 申请人地址： DE Munich
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Munich
- 代理商 Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- 优先权： DE10245451 20020927
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H01L23/02
摘要：
An electronic module contains a semiconductor chip that has flexible chip contacts. The flexible chip contacts are disposed on an uppermost metallization layer and have a dimensionally stable contact plate which is connected to contact surfaces on the uppermost metallization layer via electrically conductive components in an elastomeric embedding compound.
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