发明授权
US06946036B2 Method and device for removing particles on semiconductor wafers
有权
用于去除半导体晶片上的颗粒的方法和装置
- 专利标题： Method and device for removing particles on semiconductor wafers
- 专利标题（中）： 用于去除半导体晶片上的颗粒的方法和装置
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申请号： US10085753申请日： 2002-02-28
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公开(公告)号： US06946036B2公开(公告)日： 2005-09-20
- 发明人: Toshihito Tsuga , Minoru Fube , Kazutaka Nakayama
- 申请人： Toshihito Tsuga , Minoru Fube , Kazutaka Nakayama
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Peter K. McLarty; W. James Brady, III; Frederick J. Telecky, Jr.
- 主分类号： B08B3/08
- IPC分类号： B08B3/08 ; B08B3/12 ; H01L21/00 ; H01L21/304 ; H01L21/308 ; B08B3/00
摘要：
The method for removing particles that adhere to the surface of semiconductor wafers is constituted so as to sequentially carry out a first cleaning process in which semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 104 containing a first cleaning solution consisting of ozone water, and, after said first cleaning process, a second cleaning process in which said semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 106 containing a second cleaning solution consisting of hydrogen water.
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