发明授权
- 专利标题: Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
- 专利标题(中): 具有SOI衬底的微机电系统的锚点及其制造方法
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申请号: US10627237申请日: 2003-07-25
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公开(公告)号: US06952041B2公开(公告)日: 2005-10-04
- 发明人: Markus Lutz , Aaron Partridge , Silvia Kronmueller
- 申请人: Markus Lutz , Aaron Partridge , Silvia Kronmueller
- 申请人地址: DE Stuttgart
- 专利权人: Robert Bosch GmbH
- 当前专利权人: Robert Bosch GmbH
- 当前专利权人地址: DE Stuttgart
- 代理商 Neil A. Steinberg
- 主分类号: B81B3/00
- IPC分类号: B81B3/00 ; G01P15/00 ; H01L20060101 ; H01L21/00 ; H01L27/01 ; H01L29/82 ; H01L29/84
摘要:
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.