发明授权
- 专利标题： Method for joining a silicon plate to a second plate
- 专利标题（中）： 将硅板接合到第二板的方法
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申请号： US10433525申请日： 2002-09-05
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公开(公告)号： US06955975B2公开(公告)日： 2005-10-18
- 发明人: Frank Reichenbach , Frank Fischer , Ralf Hausner , Frieder Haag , Eckhard Graf , Markus Lutz
- 申请人： Frank Reichenbach , Frank Fischer , Ralf Hausner , Frieder Haag , Eckhard Graf , Markus Lutz
- 申请人地址： DE Stuttgart
- 专利权人： Robert Bosch GmbH
- 当前专利权人： Robert Bosch GmbH
- 当前专利权人地址： DE Stuttgart
- 代理机构： Kenyon & Kenyon
- 优先权： DE10149140 20011005
- 国际申请： PCT/DE02/03282 WO 20020905
- 国际公布： WO03/03237 WO 20030417
- 主分类号： B29C65/16
- IPC分类号： B29C65/16 ; B29C65/60 ; B81C1/00 ; H01L21/20 ; H01L21/58 ; H01L21/60 ; H01L21/762 ; H01L21/30 ; H01L21/46
摘要：
A method for joining a silicon plate to a second plate, a laser beam being directed through the silicon plate at the second plate. In the process, the wavelength of the laser beam is selected in such a way that only a negligibly small amount of energy is absorbed in the silicon plate. A strongly absorbent material is hotmelted by the laser beam's energy and then produces a bond between the silicon plate and the second plate.
公开/授权文献
- US20040082145A1 Method for joining a silicon plate to a second plate 公开/授权日：2004-04-29
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