公开(公告)号：US06955975B2

公开(公告)日：2005-10-18

申请号：US10433525

申请日：2002-09-05

申请人： Frank Reichenbach ,  Frank Fischer ,  Ralf Hausner ,  Frieder Haag ,  Eckhard Graf ,  Markus Lutz

发明人： Frank Reichenbach ,  Frank Fischer ,  Ralf Hausner ,  Frieder Haag ,  Eckhard Graf ,  Markus Lutz

IPC分类号： B29C65/16 ,  B29C65/60 ,  B81C1/00 ,  H01L21/20 ,  H01L21/58 ,  H01L21/60 ,  H01L21/762 ,  H01L21/30 ,  H01L21/46

CPC分类号： B29C65/1635 ,  B29C65/1612 ,  B29C65/1683 ,  B29C65/608 ,  B29C66/1122 ,  B29C66/12421 ,  B29C66/472 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/712 ,  B29C66/7392 ,  B29K2083/00 ,  B29L2031/756 ,  B81C1/00269 ,  B81C1/00357 ,  B81C2201/019 ,  B81C2203/019 ,  H01L21/2007 ,  H01L21/76251 ,  H01L24/83 ,  H01L2224/80224 ,  H01L2224/80365 ,  H01L2224/80379 ,  H01L2224/804 ,  H01L2224/80488 ,  H01L2224/83224 ,  H01L2224/834 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83466 ,  H01L2224/83471 ,  H01L2224/83487 ,  H01L2224/8349 ,  H01L2224/83801 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for joining a silicon plate to a second plate, a laser beam being directed through the silicon plate at the second plate. In the process, the wavelength of the laser beam is selected in such a way that only a negligibly small amount of energy is absorbed in the silicon plate. A strongly absorbent material is hotmelted by the laser beam's energy and then produces a bond between the silicon plate and the second plate.

摘要翻译： 一种用于将硅板接合到第二板的方法，激光束被引导通过硅板在第二板。 在该过程中，激光束的波长以这样一种方式选择，即在硅板中仅吸收可忽略的少量能量。 强吸收性材料被激光束的能量热熔化，然后在硅板和第二板之间产生粘结。

公开(公告)号：US20050253240A1

公开(公告)日：2005-11-17

申请号：US10514364

申请日：2003-02-21

申请人： Wolfgang Nuechter ,  Frank Fischer ,  Frieder Haag ,  Eckhard Graf

发明人： Wolfgang Nuechter ,  Frank Fischer ,  Frieder Haag ,  Eckhard Graf

IPC分类号： B81B3/00 ,  B81B7/00 ,  B81C3/00 ,  H01L21/56 ,  H01L21/60 ,  H01L23/02 ,  H01L23/495 ,  H01L21/48 ,  H01L23/28

CPC分类号： B81B7/0077 ,  H01L21/563 ,  H01L23/49575 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00

摘要： A micromechanical component including a chip which is mounted on a substrate and has an encapsulated chip area which is higher than its vicinity, as well as a mounting area provided in the vicinity of the encapsulated chip area. The chip being mounted on the substrate by a mounting arrangement which is connected to the mounting area, so that the encapsulated chip area faces the substrate and is positioned at a distance therefrom. The encapsulated chip area is surrounded by an underfill beneath the chip. A method for the manufacture of the micromechanical component is also provided.

摘要翻译： 一种微机械部件，包括安装在基板上并具有高于其附近的封装芯片面积的芯片以及设置在封装芯片区域附近的安装区域。 芯片通过连接到安装区域的安装装置安装在基板上，使得封装的芯片区域面向基板并且定位在与其一定距离处。 封装的芯片区域被芯片下方的底部填充物包围。 还提供了用于制造微机械部件的方法。

公开(公告)号：US5937275A

公开(公告)日：1999-08-10

申请号：US809945

申请日：1997-10-27

申请人： Horst Munzel ,  Michael Offenberg ,  Klaus Heyers ,  Bernhard Elsner ,  Markus Lutz ,  Helmut Skapa ,  Heinz-Georg Vossenberg ,  Nicholas Buchan ,  Eckhard Graf

发明人： Horst Munzel ,  Michael Offenberg ,  Klaus Heyers ,  Bernhard Elsner ,  Markus Lutz ,  Helmut Skapa ,  Heinz-Georg Vossenberg ,  Nicholas Buchan ,  Eckhard Graf

IPC分类号： G01P15/08 ,  H01L29/84 ,  G01L23/10 ,  G01P15/09

CPC分类号： G01P15/0802

摘要： A method for producing acceleration sensors is proposed, in which a silicon layer that is deposited in an epitaxial application system is used. Above sacrificial layers (2) applied to the substrate (1), the material grows in the form of a polysilicon layer (6), which has a certain surface roughness. By application of a photoresist and by a wet etching process, this surface roughness is eliminated. Alternatively, chemical-mechanical smoothing is contemplated.

摘要翻译： PCT No.PCT / DE96 / 01236 Sec。 371日期1997年10月27日第 102（e）1997年10月27日PCT PCT 1996年7月9日PCT公布。 第WO97 / 04319号公报 日期1997年2月6日提出了一种用于制造加速度传感器的方法，其中使用沉积在外延应用系统中的硅层。 在施加到基板（1）的牺牲层（2）上方，材料以具有一定表面粗糙度的多晶硅层（6）的形式生长。 通过施加光致抗蚀剂和通过湿蚀刻工艺，可以消除该表面粗糙度。 或者，考虑化学机械平滑化。

公开(公告)号：US6140709A

公开(公告)日：2000-10-31

申请号：US306181

申请日：1999-05-06

申请人： Horst Muenzel ,  Michael Offenberg ,  Udo Bischof ,  Eckhard Graf ,  Markus Lutz

发明人： Horst Muenzel ,  Michael Offenberg ,  Udo Bischof ,  Eckhard Graf ,  Markus Lutz

IPC分类号： H01L23/12 ,  B81B7/00 ,  B81C1/00 ,  G01C19/56 ,  G01P15/08 ,  H01L21/60 ,  H01L23/48 ,  H01L29/40 ,  H01L25/52

CPC分类号： G01P15/0802 ,  B81C1/00301 ,  B81C1/00801 ,  G01C19/56 ,  H01L24/02 ,  B81B2207/07 ,  B81B2207/097 ,  B81C2201/014 ,  B81C2201/053 ,  H01L2224/0401 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074

摘要： A bonding pad structure, in particular for a micromechanical sensor, includes a substrate, an electrically insulating sacrificial layer provided on the substrate, a patterned conductor path layer buried in the sacrificial layer, a contact hole provided in the sacrificial layer, and a bonding pad base, composed of an electrically conductive material. The bonding pad base has a first region extending over the sacrificial layer, and a second layer in contact with the conductor path region and extending through the contact hole. A protective layer is provided at least temporarily on the sacrificial layer in a specific region beneath and around the bonding pad base to prevent underetching of the sacrificial layer beneath the bonding pad base during etching of the sacrificial layer in such a way that the substrate and/or the conductor path is exposed.

摘要翻译： 特别是用于微机械传感器的焊盘结构包括衬底，设置在衬底上的电绝缘牺牲层，埋在牺牲层中的图案化导体通路层，设置在牺牲层中的接触孔，以及焊盘 基底，由导电材料组成。 焊盘基部具有在牺牲层上延伸的第一区域，以及与导体路径区域接触并延伸穿过接触孔的第二层。 保护层至少临时地设置在接合焊盘基座的下面和周围的特定区域中的牺牲层上，以防止牺牲层在蚀刻牺牲层期间的牺牲层的去抛光，使得衬底和/ 或导体路径露出。

公开(公告)号：US20080136000A1

公开(公告)日：2008-06-12

申请号：US11628100

申请日：2005-04-28

申请人： Frank Fischer ,  Eckhard Graf ,  Heiko Stahl ,  Hartmut Kueppers ,  Roland Scheuerer

发明人： Frank Fischer ,  Eckhard Graf ,  Heiko Stahl ,  Hartmut Kueppers ,  Roland Scheuerer

IPC分类号： H01L23/055 ,  H01L21/58

CPC分类号： B81B7/0041 ,  B81B7/02 ,  B81B2201/025 ,  B81C2201/019 ,  B81C2203/0145

摘要： A micromechanical component having at least two caverns is provided, the caverns being delimited by the micromechanical component and a cap, and the caverns having different internal atmospheric pressures. The micromechanical component and cap are hermetically joined to one another at a first specifiable atmospheric pressure, then an access to at least one cavern is produced, and subsequently the access is hermetically closed off at a second specifiable atmospheric pressure.

摘要翻译： 提供具有至少两个洞穴的微机械部件，该洞穴由微机械部件和盖限定，并且该洞穴具有不同的内部大气压力。 微机械部件和盖子以第一可指定的大气压力彼此气密地接合，然后产生对至少一个洞穴的通路，随后在第二可指定的大气压力下将通道气密地关闭。

公开(公告)号：US20050112843A1

公开(公告)日：2005-05-26

申请号：US10956997

申请日：2004-09-30

申请人： Frank Fischer ,  Eckhard Graf

发明人： Frank Fischer ,  Eckhard Graf

IPC分类号： H01L21/20 ,  H01L21/58 ,  H01L21/762 ,  H01L21/00 ,  H01L21/30 ,  H01L27/01 ,  H01L27/12 ,  H01L31/0392

CPC分类号： H01L24/83 ,  H01L21/2007 ,  H01L21/76256 ,  H01L24/26 ,  H01L2224/8385 ,  H01L2224/83894 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14

摘要： A method for anodic bonding of wafers and a device essentially composed of such bonded wafers. An intermediate layer is placed between two wafers, after which the two wafers are anodically bonded. The method and the device have the advantage of being implementable and manufacturable, respectively, in a particularly cost-effective manner. The anodically bonded intermediate layer plastically encloses any possible particles present or evens out differences in height of the wafer surfaces to be bonded and thus prevents any extensive bond defects from occurring.

摘要翻译： 用于阳极结合晶片的方法和基本上由这种键合晶片组成的器件。 将中间层放置在两个晶片之间，之后两个晶片被阳极结合。 该方法和装置具有分别以特别成本有效的方式分别实现和制造的优点。 阳极结合的中间层塑性地包裹存在的任何可能的颗粒，或者弥补待粘合的晶片表面的高度差异，从而防止发生任何广泛的粘结缺陷。

公开(公告)号：US07294894B2

公开(公告)日：2007-11-13

申请号：US10483011

申请日：2002-07-04

申请人： Frank Fischer ,  Peter Hein ,  Eckhard Graf

发明人： Frank Fischer ,  Peter Hein ,  Eckhard Graf

IPC分类号： H01L29/84

CPC分类号： B81B7/0064 ,  B81B2201/0235 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/031

摘要： A micromechanical cap structure and a corresponding manufacturing method are described. The micromechanical cap structure includes a first wafer with a micromechanical functional structure, and a second wafer to form a cap over the micromechanical functional structure. The first and second wafers have in their interior a support structure with a metal-semiconductor contact, and in their edge zone a bonding structure. The edge zone of the second wafer, when in the capped state, is arched in relation to the interior of the second wafer.

摘要翻译： 描述了微机械帽结构和相应的制造方法。 微机械帽结构包括具有微机械功能结构的第一晶片和在微机械功能结构上形成盖的第二晶片。 第一和第二晶片在其内部具有金属 - 半导体接触的支撑结构，并且在其边缘区域具有接合结构。 当处于封盖状态时，第二晶片的边缘区域相对于第二晶片的内部是拱形的。

公开(公告)号：US07153718B2

公开(公告)日：2006-12-26

申请号：US10829872

申请日：2004-04-21

申请人： Frank Fischer ,  Peter Hein ,  Eckhard Graf

发明人： Frank Fischer ,  Peter Hein ,  Eckhard Graf

IPC分类号： H01L21/00

CPC分类号： B81C1/00333 ,  B81B7/0006 ,  B81B7/007 ,  B81B2201/0235 ,  B81C2203/0118 ,  B81C2203/019

摘要： A micromechanical component having a substrate beneath at least one structured layer, in the structured layer at least one functional structure being formed, a cap which covers the functional structure, between the cap and the functional structure at least one cavity being formed, and a connecting layer which connects the cap to structured layer, as well as a method for producing the micromechanical component. To obtain a compact and robust component, the connecting layer is formed from an anodically bondable glass, i.e. a bond glass, which has a thickness in the range of 300 nm to 100 μm, which may in particular be in the range of 300 nm to 50 μm.

公开(公告)号：US20050045973A1

公开(公告)日：2005-03-03

申请号：US10483011

申请日：2002-07-04

申请人： Frank Fischer ,  Peter Hein ,  Eckhard Graf

发明人： Frank Fischer ,  Peter Hein ,  Eckhard Graf

IPC分类号： B81B1/00 ,  B81B7/00 ,  H01L27/14

CPC分类号： B81B7/0064 ,  B81B2201/0235 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/031

摘要： A micromechanical cap structure and a corresponding manufacturing method are described. The micromechanical cap structure includes a first wafer with a micromechanical functional structure, and a second wafer to form a cap over the micromechanical functional structure. The first and second wafers have in their interior a support structure with a metal-semiconductor contact, and in their edge zone a bonding structure. The edge zone of the second wafer, when in the capped state, is arched in relation to the interior of the second wafer.

摘要翻译： 描述了微机械帽结构和相应的制造方法。 微机械帽结构包括具有微机械功能结构的第一晶片和在微机械功能结构上形成盖的第二晶片。 第一和第二晶片在其内部具有金属 - 半导体接触的支撑结构，并且在其边缘区域具有接合结构。 当处于封盖状态时，第二晶片的边缘区域相对于第二晶片的内部是拱形的。

公开(公告)号：US06876048B2

公开(公告)日：2005-04-05

申请号：US10066851

申请日：2002-02-04

申请人： Frank Fischer ,  Peter Hein ,  Eckhard Graf

发明人： Frank Fischer ,  Peter Hein ,  Eckhard Graf

IPC分类号： B81C99/00 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C3/00 ,  H01L27/14 ,  H01L29/82 ,  H01L29/84

CPC分类号： B81C1/00333 ,  B81B7/0006 ,  B81B7/007 ,  B81B2201/0235 ,  B81C2203/0118 ,  B81C2203/019

摘要： A micromechanical component having a substrate beneath at least one structured layer, in the structured layer at least one functional structure being formed, a cap which covers the functional structure, between the cap and the functional structure at least one cavity being formed, and a connecting layer which connects the cap to structured layer, as well as a method for producing the micromechanical component. To obtain a compact and robust component, the connecting layer is formed from an anodically bondable glass, i.e. a bond glass, which has a thickness in the range of 300 nm to 100 μm, which may in particular be in the range of 300 nm to 50 μm.

摘要翻译： 一种微机械部件，其具有在至少一个结构化层下面的衬底，在所述结构化层中形成至少一个功能结构，覆盖所述功能结构的帽，所述帽与所述功能结构之间形成有至少一个腔，以及连接 将盖连接到结构化层的层，以及用于制造微机械部件的方法。 为了获得紧凑且坚固的部件，连接层由可阳极结合的玻璃（即，粘合玻璃）形成，该玻璃具有在300nm至100μm的范围内的厚度，其可以特别地在300nm至 妈妈妈妈