发明授权
- 专利标题： Compliant and hermetic solder seal
- 专利标题（中）： 合格和气密的焊接密封
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申请号： US10124166申请日： 2002-04-17
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公开(公告)号： US06958446B2公开(公告)日： 2005-10-25
- 发明人: Giles Humpston , Yoshikatsu Ichimura , Nancy M. Mar , Daniel J. Miller , Michael J. Nystrom , Heidi L. Reynolds , Gary R. Trott
- 申请人： Giles Humpston , Yoshikatsu Ichimura , Nancy M. Mar , Daniel J. Miller , Michael J. Nystrom , Heidi L. Reynolds , Gary R. Trott
- 申请人地址： US CA Palo Alto
- 专利权人： Agilent Technologies, Inc.
- 当前专利权人： Agilent Technologies, Inc.
- 当前专利权人地址： US CA Palo Alto
- 主分类号： G02B26/08
- IPC分类号： G02B26/08 ; B23K1/00 ; B23K35/26 ; G02B6/12 ; G02B6/35 ; G02B6/36 ; G02B6/42 ; H01J5/00 ; H05K5/06
摘要：
A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 μm and preferably about 5 μm) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.
公开/授权文献
- US20030198428A1 Compliant and hermetic solder seal 公开/授权日：2003-10-23