发明授权
- 专利标题： Method to fabricate passive components using conductive polymer
- 专利标题（中）： 使用导电聚合物制造无源元件的方法
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申请号： US09897891申请日： 2001-07-05
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公开(公告)号： US06958522B2公开(公告)日： 2005-10-25
- 发明人: Lawrence A. Clevenger , Louis L. Hsu , Carl J. Radens , Li-Kong Wang , Kwong Hon Wong
- 申请人： Lawrence A. Clevenger , Louis L. Hsu , Carl J. Radens , Li-Kong Wang , Kwong Hon Wong
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： McGinn & Gibb, PLLC
- 代理商 Robert M. Trepp, Esq.
- 主分类号： H01L27/06
- IPC分类号： H01L27/06 ; H01L29/00 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119
摘要：
A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.
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