发明授权
- 专利标题： Electronic semiconductor device having a thermal spreader
- 专利标题（中）： 具有散热器的电子半导体器件
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申请号： US10893021申请日： 2004-07-16
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公开(公告)号： US06969637B2公开(公告)日： 2005-11-29
- 发明人: Bruno Murari , Ubaldo Mastromatteo , Benedetto Vigna
- 申请人： Bruno Murari , Ubaldo Mastromatteo , Benedetto Vigna
- 申请人地址： IT Agrate Brianza
- 专利权人： STMicroelectronics S.r.l.
- 当前专利权人： STMicroelectronics S.r.l.
- 当前专利权人地址： IT Agrate Brianza
- 代理机构： Seed IP Law Group PLLC
- 代理商 Lisa K. Jorgenson; Harold H. Bennett, II
- 优先权： EP00830407 20000606
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/36 ; H01L23/373 ; H01L23/482 ; H01L21/44 ; H01L21/301 ; H01L21/46 ; H01L21/48 ; H01L21/50
摘要：
The electronic device is formed in a die including a body of semiconductor material having a first face covered by a covering structure and a second face. An integral thermal spreader of metal is grown galvanically on the second face during the manufacture of a wafer, prior to cutting into dice. The covering structure comprises a passivation region and a protective region of opaque polyimide; the protective region and the passivation region are opened above the contact pads for the passage of leads.
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