发明授权
- 专利标题： Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent
- 专利标题（中）： 用于模制用脱模剂自动处理的半导体器件的成型装置
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申请号： US10320485申请日： 2002-12-17
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公开(公告)号： US06971863B2公开(公告)日： 2005-12-06
- 发明人: Kyung-soo Park , Tae-hyuk Kim , Hoon Chang , Sung-soo Lee
- 申请人： Kyung-soo Park , Tae-hyuk Kim , Hoon Chang , Sung-soo Lee
- 申请人地址： KR Kyungki-do
- 专利权人： Samsung Electronics Co., LTD
- 当前专利权人： Samsung Electronics Co., LTD
- 当前专利权人地址： KR Kyungki-do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR2002-29608 20020528
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; B29C33/58 ; B29C45/14 ; B29C70/72
摘要：
A molding apparatus for molding semiconductor devices using a molding compound in which a mold is automatically treated with a mold releasing agent is provided. A lead frame strip in-magazine part and a tablet loading part are designed so that dummy lead frame strips and releasing tablets used in a mold releasing agent treatment process are automatically supplied to the molding apparatus in a mold releasing agent treatment mode or a mold cleaning mode. After the mold releasing agent treatment mode or mold cleaning mode is complete, the molding apparatus is switched back to a normal molding process and normal lead frame strips and molding compound tablets are to the mold part. In addition, a pick-up part and a stack magazine part are designed to distinguish by-products generated during the mold releasing agent treatment process from normally molded products by switching from a normal molding process to either a mold releasing agent treatment process or a mold cleaning process.
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