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    Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent
    4.
    发明授权
    Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent 有权
    用于模制用脱模剂自动处理的半导体器件的成型装置

    公开(公告)号：US06971863B2

    公开(公告)日：2005-12-06

    申请号：US10320485

    申请日：2002-12-17

    申请人： Kyung-soo Park ,  Tae-hyuk Kim ,  Hoon Chang ,  Sung-soo Lee

    发明人： Kyung-soo Park ,  Tae-hyuk Kim ,  Hoon Chang ,  Sung-soo Lee

    IPC分类号： H01L21/56 ,  B29C33/58 ,  B29C45/14 ,  B29C70/72

    CPC分类号： B29C33/58 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A molding apparatus for molding semiconductor devices using a molding compound in which a mold is automatically treated with a mold releasing agent is provided. A lead frame strip in-magazine part and a tablet loading part are designed so that dummy lead frame strips and releasing tablets used in a mold releasing agent treatment process are automatically supplied to the molding apparatus in a mold releasing agent treatment mode or a mold cleaning mode. After the mold releasing agent treatment mode or mold cleaning mode is complete, the molding apparatus is switched back to a normal molding process and normal lead frame strips and molding compound tablets are to the mold part. In addition, a pick-up part and a stack magazine part are designed to distinguish by-products generated during the mold releasing agent treatment process from normally molded products by switching from a normal molding process to either a mold releasing agent treatment process or a mold cleaning process.

    摘要翻译： 提供了一种用于模制使用模塑料的半导体器件的成型设备，其中模具被脱模剂自动处理。 引线框条盒内部片剂和片剂装载部分被设计成使得在脱模剂处理过程中使用的虚拟引线框带和释放片在脱模剂处理模式或模具清洁中被自动提供给模制设备 模式。 在脱模剂处理模式或模具清洁模式完成之后，将成型装置切换回正常的成型工艺，并将正常的引线框条和模塑复合片放置在模具部分。 此外，拾取部分和堆叠盒部分被设计成将脱模剂处理过程中产生的副产物与正常模制产品相区分，从正常模塑过程切换到脱模剂处理工艺或模具 清洗过程。

    Snap cure device for semiconductor chip attachment
    5.
    发明申请
    Snap cure device for semiconductor chip attachment 审中-公开
    用于半导体芯片连接的快速固化装置

    公开(公告)号：US20050126696A1

    公开(公告)日：2005-06-16

    申请号：US10976790

    申请日：2004-11-01

    申请人： Kook-Jin Oh ,  Young-Han Kwon ,  Tae-Hyuk Kim ,  Suk-Chun Jung ,  Byung-Soo Kim ,  Sang-Woo Lee ,  Jung-Hyon Byon

    发明人： Kook-Jin Oh ,  Young-Han Kwon ,  Tae-Hyuk Kim ,  Suk-Chun Jung ,  Byung-Soo Kim ,  Sang-Woo Lee ,  Jung-Hyon Byon

    IPC分类号： H01L21/52 ,  H01L21/00 ,  H01L21/677 ,  B32B31/00 ,  H01L21/30 ,  H01L21/46

    CPC分类号： H01L21/67754 ,  H01L21/67103

    摘要： Provided are a variety of snap cure apparatus configuration and corresponding methods for operating each such apparatus in order to snap cure an adhesive composition. Each of the configurations includes at least one vertical stack of heater blocks whereby the horizontal area required for conducting the snap cure processing may be reduced. Depending on the configuration utilized, two or more transfer devices may be required to remove the substrate(s) from a conveyor, index the substrate(s) through the heater blocks to apply the predetermined thermal cycle and return the cured substrate to the conveyor. Similarly, depending on the particular adhesive utilized, the number, relative temperatures, and duration of the substrate(s) on each of the heater blocks may be adjusted to provide the desired degree of curing.

    摘要翻译： 提供了各种快速固化设备配置和用于操作每个这样的设备的相应方法，以便将粘合剂组合物快速固化。 每个配置包括至少一个垂直堆叠的加热器块，由此可以减少用于进行快速固化处理所需的水平面积。 根据所使用的配置，可能需要两个或更多个转移装置以从输送机移除基材，从而将基底指引通过加热器块以施加预定的热循环并将固化的基底返回到输送机。 类似地，取决于所使用的具体粘合剂，可以调节每个加热器块上的基底的数量，相对温度和持续时间以提供所需的固化程度。