Invention Grant
- Patent Title: Compliant package with conductive elastomeric posts
- Patent Title (中): 符合导电弹性体支架的包装
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Application No.: US10643701Application Date: 2003-08-19
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Publication No.: US06972495B2Publication Date: 2005-12-06
- Inventor: Joseph Fjelstad
- Applicant: Joseph Fjelstad
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/60 ; H01L23/485 ; H01L23/498 ; H01L23/29

Abstract:
An assembly including a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface; and conductive elastomeric posts formed by curing a conductive elastomeric material, wherein each of the contacts of the first microelectronic element is respectively aligned with one of the contacts of the second microelectronic element, and further wherein at least some of the contacts of the first element are connected to the respectively aligned contacts of the second element by the conductive elastomeric material.
Public/Granted literature
- US20040169263A1 Compliant package with conductive elastomeric posts Public/Granted day:2004-09-02
Information query
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