Invention Grant
- Patent Title: Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials
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Application No.: US10956162Application Date: 2004-09-30
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Publication No.: US06974723B2Publication Date: 2005-12-13
- Inventor: James C. Matayabas, Jr. , Paul A. Koning , Ashay A. Dani , Christopher L. Rumer
- Applicant: James C. Matayabas, Jr. , Paul A. Koning , Ashay A. Dani , Christopher L. Rumer
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/373 ; H01L23/42 ; H01L29/866
Abstract:
A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.
Public/Granted literature
Information query
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