Invention Grant
- Patent Title: Stencil mask for ion implantation
- Patent Title (中): 用于离子注入的模板掩模
-
Application No.: US10854710Application Date: 2004-05-27
-
Publication No.: US06979520B2Publication Date: 2005-12-27
- Inventor: Hitoshi Noguchi
- Applicant: Hitoshi Noguchi
- Applicant Address: JP Tokyo
- Assignee: Shin Etsu Chemical Co., Ltd.
- Current Assignee: Shin Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2003-149445 20030527
- Main IPC: H01L21/265
- IPC: H01L21/265 ; G03F1/20 ; H01J37/317 ; G03F9/00

Abstract:
There is disclosed a stencil mask for ion implantation used in an ion implantation process of semiconductor device fabrication comprising at least a base material portion and a stencil portion, wherein the stencil portion has a diamond layer. Thereby, there can be provided a stencil mask for ion implantation used in an ion implantation process of semiconductor device fabrication, which has high resistance to ion irradiation, and which can stably perform ion implantation of high precision and high purity for long time.
Public/Granted literature
- US20040238759A1 Stencil mask for ion implantation Public/Granted day:2004-12-02
Information query
IPC分类: