Invention Grant
- Patent Title: System and method for high performance heat sink for multiple chip devices
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Application No.: US10749610Application Date: 2003-12-31
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Publication No.: US06979899B2Publication Date: 2005-12-27
- Inventor: Darvin R. Edwards
- Applicant: Darvin R. Edwards
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorported
- Current Assignee: Texas Instruments Incorported
- Current Assignee Address: US TX Dallas
- Agent Yingsheng Tung; Wade James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/36 ; H01L23/42
Abstract:
A custom-molded heat sink corresponds to an individual substrate and includes a heat sink lid having at least one cavity corresponding to at least one die mounted on a substrate. A conductive layer is deposited in the at least one cavity that substantially fills the space between the at least one cavity and the at least one die when the lid is coupled to the substrate.
Public/Granted literature
- US20050146021A1 System and method for high performance heat sink for multiple chip devices Public/Granted day:2005-07-07
Information query
IPC分类:
