发明授权
- 专利标题: Semicondutor device having ferroelectric capacitor and hydrogen barrier film and manufacturing method thereof
- 专利标题(中): 具有铁电电容器和氢阻挡膜的半导体器件及其制造方法
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申请号: US10602764申请日: 2003-06-25
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公开(公告)号: US06982453B2公开(公告)日: 2006-01-03
- 发明人: Hiroyuki Kanaya , Toyota Morimoto , Osamu Hidaka , Yoshinori Kumura , Iwao Kunishima , Tsuyoshi Iwamoto
- 申请人: Hiroyuki Kanaya , Toyota Morimoto , Osamu Hidaka , Yoshinori Kumura , Iwao Kunishima , Tsuyoshi Iwamoto
- 申请人地址: JP Kanagawa-ken
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Kanagawa-ken
- 代理机构: Banner & Witcoff, Ltd.
- 优先权: JP11-135066 19990514
- 主分类号: H01L27/11
- IPC分类号: H01L27/11 ; G01C11/22
摘要:
A semiconductor device having a semiconductor substrate; an insulating film formed on said semiconductor substrate; a ferroelectric capacitor having a lower electrode, a ferroelectric film and an upper electrode which are stacked sequentially on the insulating film; a first hydrogen barrier film; a first inter-layer insulating film covering said ferroelectric capacitor; and a second inter-layer insulating film stacked on the first inter-layer insulating film, the first hydrogen barrier film being interposed between the first and second interlayer insulating films is proposed.
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