Invention Grant
- Patent Title: Shallow trench isolation (STI) region with high-K liner and method of formation
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Application No.: US10642916Application Date: 2003-08-18
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Publication No.: US06984569B2Publication Date: 2006-01-10
- Inventor: Olov B. Karlsson , HaiHong Wang , Bin Yu , Zoran Krivokapic , Qi Xiang
- Applicant: Olov B. Karlsson , HaiHong Wang , Bin Yu , Zoran Krivokapic , Qi Xiang
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Main IPC: H01L21/8224
- IPC: H01L21/8224

Abstract:
A shallow trench isolation region formed in a layer of semiconductor material. The shallow trench isolation region includes a trench formed in the layer of semiconductor material, the trench being defined by sidewalls and a bottom; a liner within the trench formed from a high-K material, the liner conforming to the sidewalls and bottom of the trench; and a fill section made from isolating material, and disposed within and conforming to the high-K liner. A method of forming the shallow trench isolation region is also disclosed.
Public/Granted literature
- US20050073022A1 Shallow trench isolation (STI) region with high-K liner and method of formation Public/Granted day:2005-04-07
Information query
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