Invention Grant
- Patent Title: Method for making a multi-die chip
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Application No.: US10456319Application Date: 2003-06-06
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Publication No.: US06989582B2Publication Date: 2006-01-24
- Inventor: Jeffry Joseph Sniegowski , Murray Steven Rodgers
- Applicant: Jeffry Joseph Sniegowski , Murray Steven Rodgers
- Applicant Address: US NM Albuquerque
- Assignee: MEMX, Inc.
- Current Assignee: MEMX, Inc.
- Current Assignee Address: US NM Albuquerque
- Agency: Marsh Fischmann & Breyfogle LLP
- Main IPC: H01L23/544
- IPC: H01L23/544
Abstract:
The present invention generally relates to a die perimeter region of a die having a microelectromechanical assembly fabricated thereon. This die perimeter region may be configured to facilitate electrically interconnecting adjacent die on a wafer. Moreover, this die perimeter region may be configured to facilitate separating the die from a wafer.
Public/Granted literature
- US20030197248A1 Method for making a multi-die chip Public/Granted day:2003-10-23
Information query
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