发明授权
- 专利标题： Process for manufacturing multilayer flexible wiring boards
- 专利标题（中）： 多层柔性布线板制造工艺
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申请号： US10423978申请日： 2003-04-28
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公开(公告)号： US06991148B2公开(公告)日： 2006-01-31
- 发明人: Hideyuki Kurita , Masanao Watanabe , Masayuki Nakamura , Mitsuhiro Fukuda , Hiroyuki Usui
- 申请人： Hideyuki Kurita , Masanao Watanabe , Masayuki Nakamura , Mitsuhiro Fukuda , Hiroyuki Usui
- 申请人地址： JP Tokyo JP Tokyo
- 专利权人： Sony Corporation,Sony Chemicals Corp.
- 当前专利权人： Sony Corporation,Sony Chemicals Corp.
- 当前专利权人地址： JP Tokyo JP Tokyo
- 代理机构： Oliff & Berridge, PLC
- 优先权： JP11-239358 19990826; JP11-246954 19990901; JP11-246963 19990901
- 主分类号： B23K1/06
- IPC分类号： B23K1/06 ; B23K20/12
摘要：
The multilayer flexible wiring board includes first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer. The resin film is adapted to form an opening when the bump is forced into the resin film and an ultrasonic wave is applied to the bump. The bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
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