发明授权
- 专利标题: Silicon building block architecture with flex tape
- 专利标题(中): 硅胶结构与柔性胶带结构
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申请号: US10455908申请日: 2003-06-04
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公开(公告)号: US06995465B2公开(公告)日: 2006-02-07
- 发明人: Dong Zhong , Yuan-Liang Li , Jiangqi He , Jung Kang
- 申请人: Dong Zhong , Yuan-Liang Li , Jiangqi He , Jung Kang
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H01L23/48
- IPC分类号: H01L23/48
摘要:
An apparatus is constituted with an integrated circuit and a flex tape coupled to the integrated circuit. The flex tape is employed to facilitate ingress/egress of signals to/from the integrated circuit. In one embodiment, the flex tape includes a plurality of signal traces. In another embodiment, the apparatus also includes a silicon interposer coupled to the flex tape and a substrate coupled to the silicon interposer.
公开/授权文献
- US20040245545A1 Silicon building block architecture with flex tape 公开/授权日:2004-12-09
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