发明授权
- 专利标题: Electronic part mounting apparatus and method
- 专利标题(中): 电子零件安装装置及方法
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申请号: US10627479申请日: 2003-07-25
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公开(公告)号: US06996889B2公开(公告)日: 2006-02-14
- 发明人: Kazushi Higashi , Tatsuo Sasaoka , Satoshi Horie , Takashi Omura
- 申请人: Kazushi Higashi , Tatsuo Sasaoka , Satoshi Horie , Takashi Omura
- 申请人地址: JP Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Pearne & Gordon LLP
- 优先权: JP2002-224558 20020801
- 主分类号: B23P23/00
- IPC分类号: B23P23/00
摘要:
An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.
公开/授权文献
- US20040022037A1 Electronic part mounting apparatus and method 公开/授权日:2004-02-05