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    Electronic element package and method of manufacturing the same
    2.
    发明授权
    Electronic element package and method of manufacturing the same 有权
    电子元件封装及其制造方法

    公开(公告)号：US08077447B2

    公开(公告)日：2011-12-13

    申请号：US11952173

    申请日：2007-12-07

    申请人： Kazushi Higashi ,  Shinji Ishitani

    发明人： Kazushi Higashi ,  Shinji Ishitani

    IPC分类号： H05K5/00

    CPC分类号： G01P1/023 ,  B81B7/007 ,  B81B2201/025 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  Y10T29/49 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An electronic element package includes a plate-like sensor substrate with a detector formed thereon, and a plate-like first cover substrate and a plate-like second cover substrate joined directly or indirectly to a top surface and a bottom surface, respectively, of the sensor substrate so that the sensor substrate is located between the first and second cover substrates, the sensor substrate including, a frame surrounding the detector via a space, beams joining the detector to the frame, and an electrode disposed on the frame and electrically connected to the detector, one of the first cover substrate and the second cover substrate having a through-hole which contacts an electrode. The electronic element package enables a reduction in thickness and offers improved reliability.

    摘要翻译： 电子元件封装包括其上形成有检测器的板状传感器基板，以及板状第一盖基板和板状第二盖基板，其分别直接或间接地连接到上表面和下表面 传感器基板，使得传感器基板位于第一和第二盖基板之间，传感器基板包括经由空间围绕检测器的框架，将检测器连接到框架的梁和设置在框架上的电极，并电连接到 所述检测器，所述第一覆盖基板和所述第二盖板基板中的一个具有与电极接触的通孔。 电子元件封装能够减小厚度并提供改进的可靠性。

    SEMICONDUCTOR THROUGH-ELECTRODE FORMING METHOD
    5.
    发明申请
    SEMICONDUCTOR THROUGH-ELECTRODE FORMING METHOD 有权
    半导体电极形成方法

    公开(公告)号：US20090280647A1

    公开(公告)日：2009-11-12

    申请号：US12432185

    申请日：2009-04-29

    申请人： Kazushi HIGASHI

    发明人： Kazushi HIGASHI

    IPC分类号： H01L21/768

    CPC分类号： H01L24/02 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

    摘要： When forming a resin material in a through hole, an electrode pad is formed in the bottom portion of the through hole, an insulating material is formed about the periphery of the through hole and a conductive material is formed in the central portion by an inkjet method, inkjet-ejected resins being ejected in such a manner that concavo-convex indentations and projections are formed in the surface thereof, whereby the adhesiveness between the insulating material and the conductive material and the adhesiveness between the insulating material and the inner walls of the through hole can be improved. Therefore, it is possible to suppress mechanical defects such as detachment of conductive material at the interfaces between the inner surface of the through hole and the resin or conductor layer, or electrical defects such as insulation defects, conduction defects, or the like.

    摘要翻译： 当在通孔中形成树脂材料时，在通孔的底部形成电极焊盘，在通孔的周围形成绝缘材料，并通过喷墨法在中心部分形成导电材料 喷墨喷射树脂以在其表面上形成凹凸凹凸的方式喷射，由此绝缘材料与导电材料之间的粘合性以及绝缘材料与通孔的内壁之间的粘附性 孔可以改善。 因此，可以抑制导电材料在通孔的内表面和树脂或导体层之间的界面处的剥离或诸如绝缘缺陷，导电缺陷等的电气缺陷的机械缺陷。

    Electronic device package manufacturing method and electronic device package
    6.
    发明授权
    Electronic device package manufacturing method and electronic device package 有权
    电子器件封装制造方法和电子器件封装

    公开(公告)号：US07615406B2

    公开(公告)日：2009-11-10

    申请号：US11883166

    申请日：2006-01-26

    申请人： Kazushi Higashi ,  Yukihiro Maegawa

    发明人： Kazushi Higashi ,  Yukihiro Maegawa

    IPC分类号： H01L21/00

    CPC分类号： H03H9/1092 ,  H01L23/04 ,  H01L23/053 ,  H01L2224/92144 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/00

    摘要： By joining a lid member to a base member, internal electrodes put in contact with the lid member and an electronic device connected to the internal electrodes are placed in an internal space located in between the base member and the lid member. By performing etching from a surface of the lid member on a side opposite from the base member by a prescribed method, through holes that reach the surface of the internal electrodes are formed. A conductive material is applied to the through holes, and external electrodes connected to the internal electrodes are formed in a plane, completing a thin type electronic device package.

    摘要翻译： 通过将盖构件接合到基座构件，与盖构件接触的内部电极和连接到内部电极的电子装置被放置在位于基座构件和盖构件之间的内部空间中。 通过利用规定的方法从与盖体相反侧的表面进行蚀刻，形成到达内部电极表面的通孔。 将导电材料施加到通孔，并且连接到内部电极的外部电极形成在平面中，从而完成薄型电子器件封装。

    Joining apparatus and method
    8.
    发明申请
    Joining apparatus and method 有权
    连接装置和方法

    公开(公告)号：US20060037997A1

    公开(公告)日：2006-02-23

    申请号：US11136433

    申请日：2005-05-25

    申请人： Kazushi Higashi ,  Tatsuo Sasaoka ,  Shinji Ishitani

    发明人： Kazushi Higashi ,  Tatsuo Sasaoka ,  Shinji Ishitani

    IPC分类号： B23K31/02

    CPC分类号： H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L2224/75 ,  H05K3/3489 ,  H05K2203/0285

    摘要： The joining apparatus includes a suction nozzle for holding an electronic component, a board stage for holding a circuit board in opposition to the electronic component, and an excimer ultraviolet lamp placed at an irradiation position between the positioned electronic component and circuit board. In such a joining apparatus, ultraviolet irradiation to Au bumps of the electronic component and ultraviolet irradiation to board electrodes of the circuit board are performed concurrently by the excimer ultraviolet lamp to execute cleaning process of the two metallic portions. Thereafter, ultrasonic vibrations are imparted to the two metallic portions while those metallic portions are kept in contact with each other, by which metal joining between the two metallic portions is fulfilled.

    摘要翻译： 接合装置包括用于保持电子部件的吸嘴，用于保持与电子部件相对的电路板的板台，以及放置在定位的电子部件和电路板之间的照射位置处的准分子紫外线灯。 在这样的接合装置中，由准分子紫外线灯同时进行对电子部件的Au凸块的紫外线照射和电路基板的电极板的紫外线照射，进行两个金属部的清洗处理。 此后，对这两个金属部分施加超声波振动，同时使这些金属部分彼此保持接触，由此满足两个金属部分之间的金属接合。

    Electronic part mounting apparatus and method
    9.
    发明授权
    Electronic part mounting apparatus and method 失效
    电子零件安装装置及方法

    公开(公告)号：US06996889B2

    公开(公告)日：2006-02-14

    申请号：US10627479

    申请日：2003-07-25

    申请人： Kazushi Higashi ,  Tatsuo Sasaoka ,  Satoshi Horie ,  Takashi Omura

    发明人： Kazushi Higashi ,  Tatsuo Sasaoka ,  Satoshi Horie ,  Takashi Omura

    IPC分类号： B23P23/00

    CPC分类号： H05K13/04 ,  H01L21/67739 ,  H01L24/75 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/26 ,  H05K3/3489 ,  Y10T29/5136 ,  Y10T29/5137 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00

    摘要： An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.

    摘要翻译： 电子部件安装装置包括用于通过等离子体清洁基板和电子部件的室，用于将电子部件安装在电子部件上的安装机构，以及用于将基板和电子部件从腔室输送到安装件的输送机器人 机制。 等离子体清洁后，基板和电子部件通过输送机器人迅速地传送到安装机构。 在通过安装机构将电子部件安装在基板上之后，将它们的组合进行脉冲加热。 因此，电子部件以暴露于空气的状态适当地安装在基板上。 零件安装机构简化。