Invention Grant
- Patent Title: Inductive device including bond wires
- Patent Title (中): 感应装置包括接合线
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Application No.: US10729531Application Date: 2003-12-05
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Publication No.: US06998952B2Publication Date: 2006-02-14
- Inventor: Yaping Zhou , Susan H. Downey , Sheila F. Chopin , Tu-Anh Tran , Alan H. Woosley , Peter R. Harper , Perry H. Pelley, III
- Applicant: Yaping Zhou , Susan H. Downey , Sheila F. Chopin , Tu-Anh Tran , Alan H. Woosley , Peter R. Harper , Perry H. Pelley, III
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent David G. Dolezal; Daniel D. Hill
- Main IPC: H01F27/06
- IPC: H01F27/06 ; H01F5/00
Abstract:
An inductive device (105) is formed above a substrate (225) having a conductive coil formed around a core (109). The coil comprises segments formed from a first plurality of bond wires (113) and a second plurality of bond wires (111). The first plurality of bond wires (113) extends between the core (109) and the substrate (225). Each of the first plurality of bond wires is coupled to two of a plurality of wire bond pads (117, 116). The second plurality of bond wires (111) extends over the core (109) and is coupled between two of the plurality of wire bond pads (117, 119). A shield (141) includes a portion that is positioned between the core (109) and the substrate (225).
Public/Granted literature
- US20050122198A1 Inductive device including bond wires Public/Granted day:2005-06-09
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