公开(公告)号：US09270476B2

公开(公告)日：2016-02-23

申请号：US14365453

申请日：2012-01-17

Applicant: Yaping Zhou ,  Junhui Liu

Inventor： Yaping Zhou ,  Junhui Liu

IPC: H04L12/801 ,  H04L12/54 ,  H04L12/18 ,  H04L12/437 ,  H04L12/24

CPC classification number: H04L12/1886 ,  H04L12/437 ,  H04L41/0672

Abstract: The present disclosure relates to a network protection scheme. In one embodiment, there provides a method for network protection, including the steps of: detecting a switch indicator in a network; setting a rate limit of storm protection, which is of a first value, as a second value, the second value being higher than the first value; and performing a flush operation of a Forwarding DataBase FDB.

Abstract translation: 本公开涉及网络保护方案。 在一个实施例中，提供了一种用于网络保护的方法，包括以下步骤：检测网络中的交换机指示符; 将作为第一值的第一值的风暴保护的速率限制设置为第二值，第二值高于第一值; 并执行转发数据库FDB的刷新操作。

公开(公告)号：US20130087918A1

公开(公告)日：2013-04-11

申请号：US13687218

申请日：2012-11-28

Applicant: Roger D. Weekly ,  Yaping Zhou

Inventor： Roger D. Weekly ,  Yaping Zhou

IPC: H01L23/498

CPC classification number: H01L23/49816 ,  H01L23/50 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An improved system and method for assigning power and ground pins and single ended or differential signal pairs for a ball grid array semiconductor package. In certain embodiments, the system uses a hexagonal pattern where the grid may be represented by a multiplicity of nested hexagonal patterns.

Abstract translation: 一种用于分配电源和接地引脚以及用于球栅阵列半导体封装的单端或差分信号对的改进的系统和方法。 在某些实施例中，系统使用六边形图案，其中网格可以由多个嵌套的六边形图案表示。

公开(公告)号：US08399981B2

公开(公告)日：2013-03-19

申请号：US13614102

申请日：2012-09-13

Applicant: Roger D. Weekly ,  Yaping Zhou

Inventor： Roger D. Weekly ,  Yaping Zhou

IPC: H01L23/48

CPC classification number: H01L23/49816 ,  H01L23/50 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An improved system and method for assigning power and ground pins and single ended or differential signal pairs for a ball grid array semiconductor package. In certain embodiments, the system uses a hexagonal pattern where the grid may be represented by a multiplicity of nested hexagonal patterns.

Abstract translation: 一种用于分配电源和接地引脚以及用于球栅阵列半导体封装的单端或差分信号对的改进的系统和方法。 在某些实施例中，系统使用六边形图案，其中网格可以由多个嵌套的六边形图案表示。

公开(公告)号：US20090302874A1

公开(公告)日：2009-12-10

申请号：US12135119

申请日：2008-06-06

Applicant: Paul M. Harvey ,  Samuel W. Yang ,  Yaping Zhou

Inventor： Paul M. Harvey ,  Samuel W. Yang ,  Yaping Zhou

IPC: G01R1/067

CPC classification number: G01R1/06788 ,  G01R1/06738

Abstract: A method and apparatus for probing a circuit board, is provided. One implementation involves a signal probe including a tip having a plurality of strands of flexible conductive material surrounding the tip, the strands extending out from the tip to provide multiple points of contact with the rim of a via or a conductive barrel of the via when the tip is inserted into the via, the probe tip and probe strands being made of same conductive material; such that aligning the signal probe with the via for engaging the probe tip strands with the via, and inserting the tip into the via, causes bending and flexing of the strands for making contact with a conductor on a top rim of the barrel and inside an inner wall of the barrel.

Abstract translation: 提供一种用于探测电路板的方法和装置。 一个实施方案涉及信号探针，其包括具有围绕尖端的多个柔性导电材料股的尖端，所述股线从尖端延伸出来，以提供与通孔的通孔或导电筒的边缘的多个接触点 尖端插入通孔中，探针尖端和探针线由相同的导电材料制成; 使得信号探针与用于将探针尖端股线与通孔接合并将尖端插入通孔的通孔的信号探针引起股线的弯曲和弯曲以与筒的顶部边缘上的导体接触，并且在一个 桶的内壁。

公开(公告)号：US20090189713A1

公开(公告)日：2009-07-30

申请号：US12020882

申请日：2008-01-28

Applicant: Yaping Zhou

Inventor： Yaping Zhou

IPC: H03H2/00

CPC classification number: H02J1/02 ,  H02M1/14

Abstract: A method and system for reducing the noise level of a power supply system with the implementation of a voltage controlled decoupling capacitor in an electrical circuit. Voltage variations of the power supply caused by switching currents are detected by a voltage sensor control circuit. The voltage sensor circuit compares a stable reference voltage with the varying voltage level of the power supply in order to generate a sensor control voltage. When applied to the decoupling capacitor, the control voltage adjusts the capacitance of the voltage controlled capacitor. The adjusted capacitance allows the voltage controlled decoupling capacitor to compensate for the effects of the voltage variations by supplying an increased quantity of charge to various circuit components. Thus, the voltage controlled capacitor is able to efficiently reduce noise within the power supply system.

Abstract translation: 一种用于在电路中实施电压控制的去耦电容器来降低电源系统的噪声电平的方法和系统。 由开关电流引起的电源的电压变化由电压传感器控制电路检测。 电压传感器电路将稳定的参考电压与电源的变化的电压电平进行比较，以便产生传感器控制电压。 当施加到去耦电容器时，控制电压调节压控电容器的电容。 经调整的电容允许电压控制去耦电容器通过向各种电路部件提供增加的电荷来补偿电压变化的影响。 因此，压控电容器能够有效地降低供电系统内的噪声。

公开(公告)号：US07049694B2

公开(公告)日：2006-05-23

申请号：US11270300

申请日：2005-11-09

Applicant: Yaping Zhou ,  Chu-Chung Lee

Inventor： Yaping Zhou ,  Chu-Chung Lee

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L24/85 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45166 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00

Abstract: A semiconductor package uses various forms of conductive traces that connect to die bond pads via bond wires. In one form, adjacent bond wires are intentionally crossed around midpoints thereof to reduce self-inductance of the conductors and to minimize self-inductance. In another form, bond wires associated with bond pads having intervening, unrelated bond pads are crossed. Additionally, conductive traces are divided into separate sections and electrically connected by crossed jumper wires or bond wires. Any number of separate sections may be formed for each trace, but an even number is preferable. In another form, one trace is continuous and divides a second trace into two or more sections. The multiple sections are connected by an overlying bond wire. Either insulated or non-insulated bond wire may be used.

公开(公告)号：US20060065966A1

公开(公告)日：2006-03-30

申请号：US11270300

申请日：2005-11-09

Applicant: Yaping Zhou ,  Chu-Chung Lee

Inventor： Yaping Zhou ,  Chu-Chung Lee

IPC: H01L23/52

CPC classification number: H01L24/85 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45166 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00

Abstract: A semiconductor package uses various forms of conductive traces that connect to die bond pads via bond wires. In one form, adjacent bond wires are intentionally crossed around midpoints thereof to reduce self-inductance of the conductors and to minimize self-inductance. In another form, bond wires associated with bond pads having intervening, unrelated bond pads are crossed. Additionally, conductive traces are divided into separate sections and electrically connected by crossed jumper wires or bond wires. Any number of separate sections may be formed for each trace, but an even number is preferable. In another form, one trace is continuous and divides a second trace into two or more sections. The multiple sections are connected by an overlying bond wire. Either insulated or non-insulated bond wire may be used.

公开(公告)号：US06992377B2

公开(公告)日：2006-01-31

申请号：US10787288

申请日：2004-02-26

Applicant: Yaping Zhou ,  Chu-Chung Lee

Inventor： Yaping Zhou ,  Chu-Chung Lee

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L24/85 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45166 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00

Abstract: A semiconductor package uses various forms of conductive traces that connect to die bond pads via bond wires. In one form, adjacent bond wires are intentionally crossed around midpoints thereof to reduce self-inductance of the conductors and to minimize self-inductance. In another form, bond wires associated with bond pads having intervening, unrelated bond pads are crossed. Additionally, conductive traces are divided into separate sections and electrically connected by crossed jumper wires or bond wires. Any number of separate sections may be formed for each trace, but an even number is preferable. In another form, one trace is continuous and divides a second trace into two or more sections. The multiple sections are connected by an overlying bond wire. Either insulated or non-insulated bond wire may be used.

公开(公告)号：US20120001327A1

公开(公告)日：2012-01-05

申请号：US12827693

申请日：2010-06-30

Applicant: Yaping Zhou ,  Roger D. Weekly

Inventor： Yaping Zhou ,  Roger D. Weekly

IPC: H01L23/485

CPC classification number: H01L23/49816 ,  H01L23/50 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An improved system and method for assigning power and ground pins and single ended or differential signal pairs for a ball grid array semiconductor package. In certain embodiments, the system uses a hexagonal pattern where the grid may be represented by a multiplicity of nested hexagonal patterns.

Abstract translation: 一种用于分配电源和接地引脚以及用于球栅阵列半导体封装的单端或差分信号对的改进的系统和方法。 在某些实施例中，系统使用六边形图案，其中网格可以由多个嵌套的六边形图案表示。

公开(公告)号：US20080189090A1

公开(公告)日：2008-08-07

申请号：US11671852

申请日：2007-02-06

Applicant: Makoto Aikawa ,  Sang H. Dhong ,  Brian Flachs ,  Gilles Gervais ,  Yoichi Nishino ,  Iwao Takiguchi ,  Tetsuji Tamura ,  Yaping Zhou

Inventor： Makoto Aikawa ,  Sang H. Dhong ,  Brian Flachs ,  Gilles Gervais ,  Yoichi Nishino ,  Iwao Takiguchi ,  Tetsuji Tamura ,  Yaping Zhou

IPC: G06G7/62 ,  G06F17/50

CPC classification number: G06F17/5036 ,  G01R31/318357

Abstract: A system and method for determining a guard band for an operating voltage of an integrated circuit device are provided. The system and method provide a mechanism for calculating the guard band based on a comparison of simulated noise obtained from a simulation of the integrated circuit device using a worst case waveform stimuli with simulated or measured power supply noise of a workload/test pattern that may be achieved using testing equipment. A scaling factor for the guard band is determined by comparing results of a simulation of a workload/test pattern with measured results of the workload/test pattern as applied to a hardware implementation of the integrated circuit device. This scaling factor is applied to a difference between the noise generated through simulation of the workload/test pattern and the noise generated through simulation of the worst case current waveform to generate a guard band value.

Abstract translation: 提供了一种用于确定集成电路装置的工作电压的保护带的系统和方法。 该系统和方法提供了一种基于使用最差情况波形刺激从集成电路装置的模拟获得的模拟噪声与可能是工作负载/测试模式的模拟或测量的电源噪声的比较来计算保护频带的机制 使用测试设备实现。 通过将工作负载/测试模式的仿真结果与应用于集成电路设备的硬件实现的工作负载/测试模式的测量结果进行比较来确定保护频带的缩放因子。 该缩放因子被应用于通过模拟工作负载/测试模式产生的噪声与通过模拟最坏情况电流波形产生的噪声之间的差异以产生保护带值。