发明授权
- 专利标题： Multilayer wiring board
- 专利标题（中）： 多层接线板
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申请号： US10629770申请日： 2003-07-30
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公开(公告)号： US07002080B2公开(公告)日： 2006-02-21
- 发明人: Motoaki Tani , Nobuyuki Hayashi , Tomoyuki Abe , Yasuhito Takahashi , Takashi Shuto
- 申请人： Motoaki Tani , Nobuyuki Hayashi , Tomoyuki Abe , Yasuhito Takahashi , Takashi Shuto
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Staas & Halsey LLP
- 优先权： JP2002-247846 20020827
- 主分类号： H05K1/00
- IPC分类号： H05K1/00
摘要：
A multilayer wiring board is composed of a core portion, a first wiring portion and a second wiring portion. The core portion includes a core insulating layer containing a carbon fiber material. The first wiring portion is bonded to the core portion and has a laminated structure including at least a first insulating layer and a first wiring pattern, the first insulating layer containing glass cloth. The second wiring portion is bonded to the first wiring portion and has a laminated structure including at least a second insulating layer and a second wiring pattern. The core portion, the first wiring portion and the second wiring portion are arranged in a stack.
公开/授权文献
- US20040040738A1 Multilayer wiring board 公开/授权日：2004-03-04
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