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    Multilayer wiring board
    1.
    发明授权
    Multilayer wiring board 有权
    多层接线板

    公开(公告)号：US07002080B2

    公开(公告)日：2006-02-21

    申请号：US10629770

    申请日：2003-07-30

    申请人： Motoaki Tani ,  Nobuyuki Hayashi ,  Tomoyuki Abe ,  Yasuhito Takahashi ,  Takashi Shuto

    发明人： Motoaki Tani ,  Nobuyuki Hayashi ,  Tomoyuki Abe ,  Yasuhito Takahashi ,  Takashi Shuto

    IPC分类号： H05K1/00

    CPC分类号： H05K3/4641 ,  H05K1/0366 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0323 ,  H05K2201/09536 ,  Y10T428/24917

    摘要： A multilayer wiring board is composed of a core portion, a first wiring portion and a second wiring portion. The core portion includes a core insulating layer containing a carbon fiber material. The first wiring portion is bonded to the core portion and has a laminated structure including at least a first insulating layer and a first wiring pattern, the first insulating layer containing glass cloth. The second wiring portion is bonded to the first wiring portion and has a laminated structure including at least a second insulating layer and a second wiring pattern. The core portion, the first wiring portion and the second wiring portion are arranged in a stack.

    摘要翻译： 多层布线板由芯部，第一布线部和第二布线部构成。 芯部包括含有碳纤维材料的芯绝缘层。 第一布线部分结合到芯部，并具有包括至少第一绝缘层和第一布线图案的层压结构，第一绝缘层包含玻璃布。 第二布线部分接合到第一布线部分，并且具有至少包括第二绝缘层和第二布线图案的层叠结构。 芯部分，第一布线部分和第二布线部分布置成堆叠。

    PACKAGE ASSEMBLY FOR EMBEDDED DIE AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS
    4.
    发明申请
    PACKAGE ASSEMBLY FOR EMBEDDED DIE AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS 有权
    封装组件用于嵌入式模块及相关技术和配置

    公开(公告)号：US20150001731A1

    公开(公告)日：2015-01-01

    申请号：US13928179

    申请日：2013-06-26

    申请人： Takashi Shuto

    发明人： Takashi Shuto

    IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L23/48 ,  H01L25/18

    CPC分类号： H01L23/562 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/19 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： Embodiments of the present disclosure are directed towards a package assembly for embedded die and associated techniques and configurations. In one embodiment, an apparatus includes a package assembly comprising a die attach layer, a die coupled with the die attach layer, the die having an active side including active devices of the die and an inactive side disposed opposite to the active side, a reinforced plate coupled with the die attach layer, the reinforced plate having a first side and a second side disposed opposite to the first side and a cavity disposed in the reinforced plate and one or more build-up layers coupled with the second side of the reinforced plate, the one or more build-up layers including an insulator and conductive features disposed in the insulator, the conductive features being electrically coupled with the die, wherein the inactive side of the die is in direct contact with the die attach layer, the first side of the reinforced plate is in direct contact with the die attach layer and the die is disposed in the cavity. Other embodiments may be described and/or claimed.

    摘要翻译： 本公开的实施例涉及用于嵌入式管芯的封装组件和相关联的技术和构造。 在一个实施例中，一种装置包括：封装组件，其包括管芯附接层，与管芯附着层耦合的管芯，该管芯具有包括管芯的有源器件的活动侧和与活性侧相对设置的不活动侧， 所述加强板具有与所述第一侧相对设置的第一侧和第二侧以及设置在所述加强板中的空腔和与所述加强板的第二侧联接的一个或多个堆积层， 所述一个或多个堆积层包括设置在所述绝缘体中的绝缘体和导电特征，所述导电特征与所述管芯电耦合，其中所述管芯的非活性侧与所述管芯附着层直接接触，所述第一侧 的加强板与模片附接层直接接触，并且模具设置在空腔中。 可以描述和/或要求保护其他实施例。

    Method of manufacturing circuit board
    6.
    发明授权
    Method of manufacturing circuit board 有权
    电路板制造方法

    公开(公告)号：US07152314B2

    公开(公告)日：2006-12-26

    申请号：US10765209

    申请日：2004-01-28

    申请人： Takashi Shuto ,  Takefumi Kashiwa ,  Kenji Takano ,  Kenji Iida ,  Kenichiro Abe

    发明人： Takashi Shuto ,  Takefumi Kashiwa ,  Kenji Takano ,  Kenji Iida ,  Kenichiro Abe

    IPC分类号： H05K3/36

    CPC分类号： H05K3/4682 ,  H05K3/0058 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/085 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913

    摘要： The method of manufacturing a circuit board is capable of preventing deformation of a core substrate, ensuring size thereof and highly concentrating cable patterns so as to realize compact and high-performance semiconductor devices. The method of manufacturing a circuit board of the present invention comprises the steps of: forming a multilayered body, in which cable patterns on different layers insulated by an insulating layer are electrically connected, on a core substrate by a buildup process; and separating the multilayered body from the core substrate. A metal layer is vacuum-adhered on the core substrate. The multilayered body is formed on the metal layer by the buildup process and separated from the core substrate together with the metal layer by breaking the vacuum state between the core substrate and the metal layer

    摘要翻译： 制造电路板的方法能够防止芯基板的变形，确保其尺寸和高集中电缆图案，以实现紧凑且高性能的半导体器件。 本发明的制造电路板的方法包括以下步骤：通过堆积工艺，在芯基板上形成将由绝缘层绝缘的不同层上的电缆图案电连接的多层体; 以及将所述多层体与所述芯基板分离。 将金属层真空附着在芯基板上。 多层体通过堆积工艺形成在金属层上，并通过破坏芯基板和金属层之间的真空状态与金属层一起与核心基板分离