发明授权
- 专利标题: Laser irradiation apparatus and method
- 专利标题(中): 激光照射装置及方法
-
申请号: US10606805申请日: 2003-06-27
-
公开(公告)号: US07005605B2公开(公告)日: 2006-02-28
- 发明人: Koki Ichihashi , Daisuke Yokohagi , Daiji Narita , Katsuichi Ukita , Hidehiko Karasaki
- 申请人: Koki Ichihashi , Daisuke Yokohagi , Daiji Narita , Katsuichi Ukita , Hidehiko Karasaki
- 申请人地址: JP Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2001-301713 20010928
- 主分类号: B23K26/06
- IPC分类号: B23K26/06
摘要:
A laser machining apparatus machines a workpiece at uniform intensity by converting a CO2 laser beam to uniform intensity using an intensity-converting element and a phase-matching element. The optical transmission system is configured such that the starting point of the laser beam pointing vector and the exit face of the intensity-converting element are mutually conjugated with respect to the optical transmission system. This structure offers stable machining by ensuring that the laser beam always enters the intensity-converting element at its center, even if the pointing vector of the laser beam shifts.
公开/授权文献
- US20040084607A1 Laser irradiation apparatus and method 公开/授权日:2004-05-06
信息查询
IPC分类: