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    Laser processing apparatus with position controller
    2.
    发明授权
    Laser processing apparatus with position controller 有权
    带位置控制器的激光加工设备

    公开(公告)号：US06721343B2

    公开(公告)日：2004-04-13

    申请号：US09873299

    申请日：2001-06-05

    申请人： Kenji Kawazoe ,  Katsuichi Ukita

    发明人： Kenji Kawazoe ,  Katsuichi Ukita

    IPC分类号： H01S300

    CPC分类号： G05B19/416 ,  B23K26/042 ,  B23K26/08 ,  B23K26/082 ,  G05B2219/45035 ,  G05B2219/45139 ,  H05K3/0008 ,  H05K3/0026

    摘要： A laser processing apparatus comprises a laser generator for generating laser light, a laser controller for controlling the laser generator, a positioning unit for positioning the laser light, a control method memory for storing an optimum control method corresponding to the moving distance of the positioning unit, and a position controller for controlling the position of the positioning unit by the optimum control method. Controlling the position by the optimum control method corresponding to the moving distance increases a processing speed.

    摘要翻译： 一种激光加工装置，包括用于产生激光的激光发生器，用于控制激光发生器的激光控制器，用于定位激光的定位单元，用于存储对应于定位单元的移动距离的最佳控制方法的控制方法存储器 以及位置控制器，用于通过最佳控制方法控制定位单元的位置。 通过与移动距离相对应的最佳控制方法来控制位置增加了处理速度。

    Laser irradiation apparatus and method
    4.
    发明授权
    Laser irradiation apparatus and method 有权
    激光照射装置及方法

    公开(公告)号：US07005605B2

    公开(公告)日：2006-02-28

    申请号：US10606805

    申请日：2003-06-27

    申请人： Koki Ichihashi ,  Daisuke Yokohagi ,  Daiji Narita ,  Katsuichi Ukita ,  Hidehiko Karasaki

    发明人： Koki Ichihashi ,  Daisuke Yokohagi ,  Daiji Narita ,  Katsuichi Ukita ,  Hidehiko Karasaki

    IPC分类号： B23K26/06

    CPC分类号： G02B27/0927 ,  B23K26/066 ,  B23K26/073 ,  B23K2101/36 ,  G02B27/09 ,  G02B27/0955

    摘要： A laser machining apparatus machines a workpiece at uniform intensity by converting a CO2 laser beam to uniform intensity using an intensity-converting element and a phase-matching element. The optical transmission system is configured such that the starting point of the laser beam pointing vector and the exit face of the intensity-converting element are mutually conjugated with respect to the optical transmission system. This structure offers stable machining by ensuring that the laser beam always enters the intensity-converting element at its center, even if the pointing vector of the laser beam shifts.

    摘要翻译： 激光加工设备通过使用强度转换元件和相位匹配元件将CO 2/2激光束转换成均匀的强度，以均匀的强度对工件进行加工。 光传输系统被配置为使得激光束指向矢量的起始点和强度转换元件的出射面相对于光传输系统相互共轭。 这种结构通过确保激光束始终在其中心处进入强度转换元件，即使激光束的指向矢量偏移也能提供稳定的加工。

    Laser device and method of controlling Q-switched frequency converted laser, process and system using laser device
    8.
    发明授权
    Laser device and method of controlling Q-switched frequency converted laser, process and system using laser device 有权
    使用激光装置控制Q开关频率转换激光器，工艺和系统的激光装置和方法

    公开(公告)号：US06782012B2

    公开(公告)日：2004-08-24

    申请号：US09873416

    申请日：2001-06-05

    申请人： Hidehiko Karasaki ,  Katsuichi Ukita

    发明人： Hidehiko Karasaki ,  Katsuichi Ukita

    IPC分类号： H01S311

    CPC分类号： B23K26/0643 ,  B23K26/064 ,  H01S3/005 ,  H01S3/0912 ,  H01S3/10038 ,  H01S3/1022 ,  H01S3/117 ,  H01S3/1306

    摘要： A harmonic Q switch laser device and its control method for obtaining a stable laser pulse while protecting a nonlinear optical crystal used for a wavelength conversion are presented. In this laser device, in a pause period of a laser train, a Q switch which is turned on makes the laser oscillates spuriously and continuously, and prevents a gain from accumulating in a gain medium Before a generation of a laser pulse, the Q switch is turned off for a specified period to raise the laser gain, so that a pulse of a specified magnitude is generated from the first shot when turning on the Q switch.

    摘要翻译： 提出了一种谐波Q开关激光器件及其控制方法，用于在保护用于波长转换的非线性光学晶体的同时获得稳定的激光脉冲。 在该激光装置中，在激光器的暂停期间，导通的Q开关使得激光器伪造和连续地振荡，并且防止增益积聚在增益介质中。在产生激光脉冲之前，Q开关 关闭一段指定的时间以提高激光增益，从而在打开Q开关时，从第一次拍摄产生一个指定幅度的脉冲。

    Laser processing method and equipment for printed circuit board
    9.
    发明授权
    Laser processing method and equipment for printed circuit board 有权
    印刷电路板的激光加工方法和设备

    公开(公告)号：US06694614B2

    公开(公告)日：2004-02-24

    申请号：US09867621

    申请日：2001-05-31

    申请人： Katsuichi Ukita ,  Kazuhide Isaji ,  Hideaki Nagatoshi ,  Hidehiko Karasaki ,  Hisashi Kinoshita ,  Tsutomu Yano

    发明人： Katsuichi Ukita ,  Kazuhide Isaji ,  Hideaki Nagatoshi ,  Hidehiko Karasaki ,  Hisashi Kinoshita ,  Tsutomu Yano

    IPC分类号： H01R4300

    CPC分类号： B23K26/032 ,  H05K1/0269 ,  H05K3/0032 ,  H05K2203/0554 ,  H05K2203/163 ,  Y10T29/49117 ,  Y10T29/49165

    摘要： A laser processes a circuit board including at least two layers. The two layers are a conductive layer with a plurality of holes and an insulating layer. The conductive layer is disposed on a surface layer of the insulating layer which is to be processed by applying a laser beam to portions of the insulating layer corresponding to the holes of the conductive layer. The circuit board is irradiated with the laser beam, and a reflected laser beam is detected, whereby the laser processing of the insulating layer corresponding to an abnormal hole in the conductive layer is stopped, if the detected value of the reflected laser beam is an abnormal value differing from a desired value. Also, the insulating layer corresponding to the hole is processed when the detected value of the reflected light conforms to the desired value.

    摘要翻译： A激光器处理包括至少两层的电路板。 这两层是具有多个孔和绝缘层的导电层。 通过将激光束施加到与导电层的孔相对应的绝缘层的部分，将导电层设置在待加工的绝缘层的表面层上。 电路板用激光束照射，并且检测反射的激光束，如果反射的激光束的检测值异常，则停止与导电层中的异常孔对应的绝缘层的激光加工 值与期望值不同。 此外，当反射光的检测值符合期望值时，处理与孔相对应的绝缘层。