发明授权
- 专利标题: Barrier stack with improved barrier properties
- 专利标题(中): 阻隔层具有改善的阻隔性能
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申请号: US10604323申请日: 2003-07-10
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公开(公告)号: US07009230B2公开(公告)日: 2006-03-07
- 发明人: Bum Ki Moon , Gerhard Beitel , Nicolas Nagel , Andreas Hilliger , Koji Yamakawa , Keitaro Imai
- 申请人: Bum Ki Moon , Gerhard Beitel , Nicolas Nagel , Andreas Hilliger , Koji Yamakawa , Keitaro Imai
- 申请人地址: DE Munich JP Tokyo
- 专利权人: Infineon Technologies Aktiengesellschaft,Kabushiki Kaisha Toshiba
- 当前专利权人: Infineon Technologies Aktiengesellschaft,Kabushiki Kaisha Toshiba
- 当前专利权人地址: DE Munich JP Tokyo
- 代理机构: Horizon IP Pte Ltd
- 主分类号: H01L29/76
- IPC分类号: H01L29/76
摘要:
An improved barrier stack for inhibiting diffusion of atoms or molecules, such as O2 is disclosed. The barrier stack is particularly useful in capacitor over plug structures to prevent plug oxidation which can adversely impact the reliability of the structures. The barrier stack includes first and second barrier layers. In one embodiment, the first barrier layer comprises first and second sub-barrier layers having mismatched grain boundaries. The sub-barrier layers are selected from, for example, Ir, Ru, Pd, Rh, or alloys thereof. By providing mismatched grain boundaries, the interface of the sub-barrier layers block the diffusion path of oxygen. To further enhance the barrier properties, the first barrier layer is passivated with O2 using, for example, a rapid thermal oxidation. The RTO forms a thin oxide layer on the surface of the first barrier layer. The oxide layer can advantageously promote mismatching of the grain boundaries of the first and second sub-barrier layer. The second barrier layer comprises a conductive oxide.
公开/授权文献
- US20040178431A1 Barrier Stack with Improved Barrier Properties 公开/授权日:2004-09-16
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