发明授权
US07012117B2 Water-dispersible resin composition for use in boring hole in printed wiring board, sheet comprising the composition, and method for boring hole in printed wiring board using the sheet
失效
用于印刷线路板的钻孔中的水分散性树脂组合物，包含该组合物的片，以及使用该片的印刷线路板中的孔的方法
- 专利标题： Water-dispersible resin composition for use in boring hole in printed wiring board, sheet comprising the composition, and method for boring hole in printed wiring board using the sheet
- 专利标题（中）： 用于印刷线路板的钻孔中的水分散性树脂组合物，包含该组合物的片，以及使用该片的印刷线路板中的孔的方法
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申请号： US10484375申请日： 2002-07-16
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公开(公告)号： US07012117B2公开(公告)日： 2006-03-14
- 发明人: Tsukasa Izumi , Hiroaki Satoh
- 申请人： Tsukasa Izumi , Hiroaki Satoh
- 申请人地址： JP Osaka
- 专利权人： The Nippon Synthetic Chemical Industry Co., Ltd.
- 当前专利权人： The Nippon Synthetic Chemical Industry Co., Ltd.
- 当前专利权人地址： JP Osaka
- 优先权： JP2001-216186 20010717
- 国际申请： PCT/JP02/07196 WO 20020716
- 国际公布： WO03/008502 WO 20030130
- 主分类号： C08L101/14
- IPC分类号： C08L101/14 ; C08L33/06 ; C08L29/04
摘要：
The present invention provides a water-dispersant resin composition for perforating a printed wiring board excellent in preciseness of the processing position and plating throwing power when perforating, a sheet for perforating using the composition, a process for perforating a printed wiring board using the sheet. More specifically, the present invention provides a water-dispersant resin composition for perforating a printed wiring board comprising a water-soluble polymer (A) and a polymer compound (B) containing the compound represented by the following formula (1) as a copolymer component, a sheet for perforating using the composition, and a process for perforating a printed wiring board using the sheet. (wherein, R represents hydrogen or a methyl group, and n represents an integer of 10 to 22).
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