Invention Grant
- Patent Title: Multiple directional scans of test structures on semiconductor integrated circuits
- Patent Title (中): 半导体集成电路测试结构的多方向扫描
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Application No.: US11058943Application Date: 2005-02-15
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Publication No.: US07012439B2Publication Date: 2006-03-14
- Inventor: Gustavo A. Pinto , Brian C. Leslie , David L. Adler , Akella V. S. Satya , Robert Thomas Long , David J. Walker
- Applicant: Gustavo A. Pinto , Brian C. Leslie , David L. Adler , Akella V. S. Satya , Robert Thomas Long , David J. Walker
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Technologies Corporation
- Current Assignee: KLA-Tencor Technologies Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Beyer Weaver & Thomas, LLP
- Main IPC: G01R31/304
- IPC: G01R31/304

Abstract:
Disclosed is a method of inspecting a sample. The sample is scanned in a first direction with at least one particle beam. The sample is scanned in a second direction with at least one particle beam. The second direction is at an angle to the first direction. The number of defects per an area of the sample are found as a result of the first scan, and the position of one or more of the found defects is determined from the second scan. In a specific embodiment, the sample includes a test structure having a plurality of test elements thereon. A first portion of the test elements is exposed to the beam during the first scan to identify test elements having defects, and a second portion of the test elements is exposed during the second scan to isolate and characterize the defect.
Public/Granted literature
- US20050139767A1 Multiple directional scans of test structures on semiconductor integrated circuits Public/Granted day:2005-06-30
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