Invention Grant
- Patent Title: System for making high-speed connections to board-mounted modules
- Patent Title (中): 用于高速连接到板载模块的系统
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Application No.: US10756924Application Date: 2004-01-13
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Publication No.: US07014472B2Publication Date: 2006-03-21
- Inventor: Joseph C. Fjelstad , Para Segaram , Thomas Obenhuber , Gary Yasumura
- Applicant: Joseph C. Fjelstad , Para Segaram , Thomas Obenhuber , Gary Yasumura
- Applicant Address: US CA San Jose
- Assignee: SiliconPipe, Inc.
- Current Assignee: SiliconPipe, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Shemwell Mahamedi LLP
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00
Abstract:
A device module may be used to carry a plurality of devices, such as memory devices or other components. The device module may include a board, a first set of contact points, and a second set of contact points. A plurality of signal paths may be provided on the board, where each signal path extends between a contact point in the first set and a contact point in the second set. Each of the plurality of signal paths has substantially an identical length and a same number of turns on the board.
Public/Granted literature
- US20050014395A1 System for making high-speed connections to board-mounted modules Public/Granted day:2005-01-20
Information query
