公开(公告)号：US20060203810A1

公开(公告)日：2006-09-14

申请号：US11430507

申请日：2006-05-09

申请人： Craig Owens ,  Thomas Obenhuber ,  Steven Herrick

发明人： Craig Owens ,  Thomas Obenhuber ,  Steven Herrick

IPC分类号： H04L12/66

CPC分类号： H04L12/6418 ,  H04L2012/563

摘要： A method for remotely communicating with a Broadband modem is provided. Once a communication error is detected on a Broadband modem, a Plain Old Telephone System (POTS) connection is established between the Broadband modem and a remote server. Communication then occurs with the remote server via the POTS connection using Dual-Tone Multi-Frequency (DTMF) tones. The communication preferably comprises transmitting information associated with the communication error to the remote server via the POTS connection using DTMF tones and receiving a diagnosis from the remote server via the POTS connection in DTMF tones. A system for remotely diagnosing a Broadband modem as well as a Broadband modem is also provided.

公开(公告)号：US20060157846A1

公开(公告)日：2006-07-20

申请号：US11353564

申请日：2006-02-13

申请人： Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Kevin Grundy ,  Inessa Obenhuber

发明人： Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Kevin Grundy ,  Inessa Obenhuber

IPC分类号： H01L23/52

CPC分类号： H01L24/85 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49537 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/32245

摘要： An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.

公开(公告)号：US07046666B1

公开(公告)日：2006-05-16

申请号：US10006364

申请日：2001-12-06

申请人： Benn Bollay ,  David B. Donahue ,  Vinai Kolli ,  Thomas Obenhuber

发明人： Benn Bollay ,  David B. Donahue ,  Vinai Kolli ,  Thomas Obenhuber

IPC分类号： H04L12/28

CPC分类号： H04L29/12009 ,  H04L29/12018 ,  H04L29/12801 ,  H04L29/12933 ,  H04L61/10 ,  H04L61/6004 ,  H04L61/6068

摘要： A method for communicating across divergent network segments in a network. The network has a first network segment and a second network segment. The first network segment includes a switch that is controlled by a module that has instructions encoding a method. In the method, an ARP request packet is received from a first device. The ARP request packet includes a request to locate a second device. The first device is coupled to the first network segment and the second device is coupled to the second network segment. The ARP request packet is broadcast to the network segments outside of the first network segment and, as a result, a reply from the second network segment is received. The reply is transmitted to the first device, such that in use, ARP tables are modified on the first device and the second device so that future communication between said first device and said second device is enabled using a layer two communication protocol without any requirement for a layer three communication protocol.

摘要翻译： 一种用于在网络中跨越不同网段进行通信的方法。 网络具有第一网段和第二网段。 第一网段包括由具有编码方法的指令的模块控制的交换机。 在该方法中，从第一设备接收到ARP请求分组。 ARP请求分组包括定位第二设备的请求。 第一设备耦合到第一网段并且第二设备耦合到第二网段。 ARP请求报文广播到第一网段之外的网段，结果接收到来自第二网段的应答。 答复被发送到第一设备，使得在使用中，在第一设备和第二设备上修改ARP表，以便使得能够使用第二层通信协议来实现所述第一设备和所述第二设备之间的未来通信，而不需要 一个三层通讯协议。

公开(公告)号：US6144638A

公开(公告)日：2000-11-07

申请号：US853862

申请日：1997-05-09

申请人： Thomas Obenhuber ,  Rodney L. Joffe

发明人： Thomas Obenhuber ,  Rodney L. Joffe

IPC分类号： H04L12/28 ,  H04L12/56 ,  H04L29/06 ,  H04L29/12

CPC分类号： H04L63/02 ,  H04L12/2856 ,  H04L12/2863 ,  H04L12/2876 ,  H04L29/12009 ,  H04L49/351 ,  H04L61/00 ,  H04L63/04 ,  H04L49/25

摘要： Systems and methods for providing multiple users with access to a public network like the Internet are provided. A single high bandwidth connection (e.g., fast Ethernet) allows the users to communicate with the public network. Each user is allocated a specific bandwidth and can freely communicate with the public network up to the allocated bandwidth. Additionally, the invention may be remotely configured to change bandwidth allocations.

摘要翻译： 提供了用于向多个用户提供对诸如因特网的公共网络的访问的系统和方法。 单个高带宽连接（例如，快速以太网）允许用户与公共网络进行通信。 每个用户被分配一个特定的带宽，并且可以自由地与公共网络通信，直到分配的带宽。 另外，本发明可以被远程配置为改变带宽分配。

公开(公告)号：US20050093152A1

公开(公告)日：2005-05-05

申请号：US10964578

申请日：2004-10-12

申请人： Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Kevin Grundy ,  William Wiedemann

发明人： Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Kevin Grundy ,  William Wiedemann

IPC分类号： H01L20060101 ,  H01L23/13 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L25/065

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.

摘要翻译： 本发明的成本有效，高性能的IC封装组件包括从IC封装组件的多个表面和电平中的任一个上的至少一个芯片到端子的阶梯层的再分配电路。 组件的关键路径电路没有电镀通孔，并且通过倒装芯片或引线键合方法将互连封装与IC芯片端子互连的互连端直接布线。

公开(公告)号：US20050091205A1

公开(公告)日：2005-04-28

申请号：US10934872

申请日：2004-09-03

申请人： Jeffrey Alan Sidlosky ,  Creighton Chong ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Para Segaram

发明人： Jeffrey Alan Sidlosky ,  Creighton Chong ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Para Segaram

IPC分类号： G06F7/00 ,  G06F17/30

CPC分类号： G06F17/30693 ,  G06F17/30867 ,  Y10S707/99933

摘要： The generation a search query based on information stored on a storage medium is described. According to one embodiment of the invention, search criteria is entered to perform a search of a storage medium of a client computer. The search of the storage medium determines a web search criteria. The client computer provides search results based on the web search criteria.

摘要翻译： 描述基于存储在存储介质上的信息的生成搜索查询。 根据本发明的一个实施例，输入搜索标准以执行对客户计算机的存储介质的搜索。 存储介质的搜索决定了网络搜索标准。 客户端计算机根据网络搜索条件提供搜索结果。

公开(公告)号：US08338713B2

公开(公告)日：2012-12-25

申请号：US11939554

申请日：2007-11-14

申请人： Joseph C. Fjelstad ,  Para K. Segaram ,  Thomas Obenhuber ,  William F. Wiedemann

发明人： Joseph C. Fjelstad ,  Para K. Segaram ,  Thomas Obenhuber ,  William F. Wiedemann

IPC分类号： H05K1/09

CPC分类号： H05K3/222 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01R12/523 ,  H01R12/7082 ,  H01R12/716 ,  H01R12/79 ,  H05K3/308 ,  H05K2201/044 ,  H05K2201/10356 ,  H05K2201/1059

摘要： An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.

摘要翻译： 用于进行电子信号的组件。 组件包括基板和电子电缆。 衬底具有不同的第一和第二区域，以分别连接到第一和第二电路板。 分别在第一和第二区域的基板中形成第一和第二通孔。 电子电缆设置在第一通孔内并且延伸出第一通孔，邻近基板并进入第二通孔。

公开(公告)号：US20090120668A1

公开(公告)日：2009-05-14

申请号：US11939554

申请日：2007-11-14

申请人： Joseph C. Fjelstad ,  Para K. Segaram ,  Thomas Obenhuber ,  William F. Wiedemann

发明人： Joseph C. Fjelstad ,  Para K. Segaram ,  Thomas Obenhuber ,  William F. Wiedemann

IPC分类号： H05K1/00

CPC分类号： H05K3/222 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01R12/523 ,  H01R12/7082 ,  H01R12/716 ,  H01R12/79 ,  H05K3/308 ,  H05K2201/044 ,  H05K2201/10356 ,  H05K2201/1059

摘要： An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.

摘要翻译： 用于进行电子信号的组件。 组件包括基板和电子电缆。 衬底具有不同的第一和第二区域，以分别连接到第一和第二电路板。 分别在第一和第二区域的基板中形成第一和第二通孔。 电子电缆设置在第一通孔内并且延伸出第一通孔，邻近基板并进入第二通孔。

公开(公告)号：US07014472B2

公开(公告)日：2006-03-21

申请号：US10756924

申请日：2004-01-13

申请人： Joseph C. Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Gary Yasumura

发明人： Joseph C. Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Gary Yasumura

IPC分类号： H01R12/00 ,  H05K1/00

CPC分类号： H05K7/1431 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01R12/716 ,  H01R12/721 ,  H05K1/14 ,  H05K1/147 ,  H05K1/148 ,  H05K3/222 ,  H05K2201/044 ,  H05K2201/1053 ,  H05K2201/10734

摘要： A device module may be used to carry a plurality of devices, such as memory devices or other components. The device module may include a board, a first set of contact points, and a second set of contact points. A plurality of signal paths may be provided on the board, where each signal path extends between a contact point in the first set and a contact point in the second set. Each of the plurality of signal paths has substantially an identical length and a same number of turns on the board.

摘要翻译： 设备模块可以用于承载诸如存储设备或其他组件的多个设备。 设备模块可以包括板，第一组接触点和第二组接触点。 多个信号路径可以设置在板上，其中每个信号路径在第一组中的接触点和第二组中的接触点之间延伸。 多个信号路径中的每一个在板上具有基本上相同的长度和相同的匝数。

公开(公告)号：US20050093127A1

公开(公告)日：2005-05-05

申请号：US10947686

申请日：2004-09-23

申请人： Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Kevin Grundy

发明人： Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Kevin Grundy

IPC分类号： H01L20060101 ,  H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L24/85 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49537 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/32245

摘要： An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.

摘要翻译： 具有多个表面的IC封装，用于与互连元件互连，从IC芯片连接到位于其多于一个表面上的封装组件的I / O端子，并且与空间上分离的其它器件或组件互连。