Invention Grant
- Patent Title: Thermal management systems for micro-components
- Patent Title (中): 微型组件的热管理系统
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Application No.: US10676977Application Date: 2003-09-30
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Publication No.: US07019971B2Publication Date: 2006-03-28
- Inventor: Sabina Houle , James C. Matayabas, Jr.
- Applicant: Sabina Houle , James C. Matayabas, Jr.
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
Apparatus and methods for providing self-contained, closed-loop microchannel cooling systems that can be integrated into a micro-component package, such as a microelectronic package, are described herein.
Public/Granted literature
- US20050068725A1 Thermal management systems for micro-components Public/Granted day:2005-03-31
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