发明授权
- 专利标题： Polishing pad surface condition evaluation method and an apparatus thereof and a method of producing a semiconductor device
- 专利标题（中）： 抛光垫表面状态评价方法及其装置以及半导体装置的制造方法
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申请号： US09774723申请日： 2001-02-01
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公开(公告)号： US07020306B2公开(公告)日： 2006-03-28
- 发明人: Takenori Hirose , Hiroyuki Kojima , Mineo Nomoto , Susumu Aiuchi
- 申请人： Takenori Hirose , Hiroyuki Kojima , Mineo Nomoto , Susumu Aiuchi
- 申请人地址： JP Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Mattingly, Stanger, Malur & Brundidge, P.C.
- 优先权： JP2000-035616 20000208
- 主分类号： G06K9/00
- IPC分类号： G06K9/00
摘要：
The object of the present invention is to establish a technology for directly evaluating polishing pad surface conditions, to allow high-precision CMP process management, and to improve process throughput. The pad surface is illuminated with light. The intensity of reflected light or fluorescence from the illuminated area or an intensity distribution image is used directly evaluate the pad surface condition. Based on the results of this evaluation, conditioning conditions for a conditioner are optimized, thus allowing high-precision CMP processing while maintaining good pad surface conditions.
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